20240038841. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240038841 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Simplified Explanation
The abstract describes a semiconductor device that aims to improve element performance and reliability. The device includes a lower conductive pattern, an upper conductive pattern, and a first plug pattern connected to both patterns. The first plug pattern consists of a first barrier pattern and a first plug metal pattern. The first plug metal pattern includes a first molybdenum pattern and a first tungsten pattern.
- The semiconductor device aims to enhance element performance and reliability.
- It includes a lower conductive pattern, an upper conductive pattern, and a first plug pattern.
- The first plug pattern is connected to both the lower and upper conductive patterns.
- The first plug pattern consists of a first barrier pattern and a first plug metal pattern.
- The first plug metal pattern includes a first molybdenum pattern and a first tungsten pattern.
Potential Applications:
- This semiconductor device can be used in various electronic devices, such as computers, smartphones, and tablets.
- It can be applied in integrated circuits, memory devices, and microprocessors.
Problems Solved:
- The device addresses the need for improved element performance and reliability in semiconductor devices.
- It solves the challenge of connecting the lower and upper conductive patterns effectively.
Benefits:
- The device enhances the performance and reliability of semiconductor elements.
- It provides a more efficient and effective connection between conductive patterns.
- The use of specific materials, such as molybdenum and tungsten, can improve the overall functionality of the device.
Original Abstract Submitted
there is provided a semiconductor device capable of capable of improving element performance and reliability. a semiconductor device includes a lower conductive pattern disposed on a substrate, an upper conductive pattern disposed on the lower conductive pattern, and a first plug pattern disposed between the lower conductive pattern and the upper conductive pattern and connected to the lower conductive pattern and the upper conductive pattern. the first plug pattern includes a first barrier pattern that defines a first plug recess and a first plug metal pattern that fills the first plug recess, and the first plug metal pattern includes a first molybdenum pattern and a first tungsten pattern disposed on the first molybdenum pattern.
