20240038830. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240038830 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application consists of a substrate, a honeycomb structure of lower electrodes arranged on the substrate, and a supporter that connects the lower electrodes to each other. The supporter has multiple supporter holes, each exposing a portion of the lower electrodes. The supporter includes first extensions that extend in a first direction and second extensions that intersect the first extensions in a second direction. The first and second extensions have convex and concave portions on their sidewalls.
- The semiconductor device has a honeycomb structure of lower electrodes connected by a supporter with supporter holes.
- The supporter has first and second extensions that intersect each other.
- The first and second extensions have convex and concave portions on their sidewalls.
Potential Applications:
- This semiconductor device can be used in electronic devices such as smartphones, tablets, and computers.
- It can be utilized in power management systems, integrated circuits, and microprocessors.
- The honeycomb structure of lower electrodes allows for efficient heat dissipation, making it suitable for high-performance devices.
Problems Solved:
- The honeycomb structure and supporter design provide improved thermal management by allowing heat to dissipate more effectively.
- The supporter holes expose the lower electrodes, enabling better electrical connectivity and reducing resistance.
- The intersecting extensions of the supporter enhance the structural stability of the device.
Benefits:
- Enhanced heat dissipation improves the overall performance and reliability of electronic devices.
- Improved electrical connectivity leads to better signal transmission and reduced power loss.
- The structural stability provided by the intersecting extensions ensures durability and longevity of the semiconductor device.
Original Abstract Submitted
the semiconductor device is provided. the semiconductor device comprises a substrate; a plurality of lower electrodes on the substrate and arranged in a honeycomb structure; and a supporter connecting the plurality of lower electrodes to each other, wherein the supporter has a plurality of supporter holes defined therein, wherein each of the plurality of supporter holes exposes at least a portion of each of the plurality of lower electrodes, wherein the supporter includes: a plurality of first extensions extending in a first direction; and a plurality of second extensions extending in a second direction so as to intersect the plurality of first extensions, wherein each of the plurality of first extensions has first and second sidewalls, wherein each of the plurality of second extensions has third and fourth sidewalls, wherein each of the first to fourth sidewalls includes a convex portion and a concave portion.
