20240038723. CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Jae-Woong Nah of Closter NJ (US)

David Abraham of Croton NY (US)

David Lokken-toyli of White Plains NY (US)

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240038723 titled 'CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

Simplified Explanation

The patent application describes systems and techniques for facilitating high-density flip-chip co-packages for superconducting qubits and parametric Josephson devices. Here are the key points:

• The device consists of a superconducting qubit wafer and a parametric Josephson wafer that are coupled together using one or more first bump-bonds.
• The device also includes a first underfill material that surrounds the first bump-bonds, providing protection to the parametric Josephson wafer during subsequent fabrication, processing, and handling of the superconducting qubit wafer.

Potential Applications:

• Quantum Computing: This technology can be applied in the field of quantum computing, specifically in the development of high-density flip-chip co-packages for superconducting qubits and parametric Josephson devices. It can enhance the performance and reliability of these devices, leading to advancements in quantum computing systems.

Problems Solved:

• Mechanical and Chemical Degradation: The first underfill material protects the parametric Josephson wafer from mechanical and chemical degradation that can occur during the fabrication, processing, and handling of the superconducting qubit wafer. This solves the problem of potential damage to the parametric Josephson wafer, ensuring its integrity and functionality.

Benefits:

• Enhanced Device Reliability: The use of the first underfill material increases the reliability of the device by protecting the parametric Josephson wafer from potential damage during subsequent fabrication and handling processes.
• Improved Performance: The high-density flip-chip co-packages facilitated by this technology can lead to improved performance of superconducting qubits and parametric Josephson devices, enabling advancements in quantum computing and other related applications.

Original Abstract Submitted

systems and techniques that facilitate high-density flip-chip co-packages for superconducting qubits and parametric josephson devices are provided. in various embodiments, a device can comprise a superconducting qubit wafer that can be coupled, by one or more first bump-bonds, to a parametric josephson wafer. in various aspects, the device can further comprise a first underfill that surrounds the one or more first bump-bonds. in various instances, the first underfill can protect the parametric josephson wafer from mechanical and/or chemical degradation associated with subsequent fabrication, processing, and/or handling of the superconducting qubit wafer.