20240038716. SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL simplified abstract (Western Digital Technologies, Inc.)
Contents
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
Organization Name
Western Digital Technologies, Inc.
Inventor(s)
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240038716 titled 'SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
Simplified Explanation
The patent application describes a method for dispensing underfill material on a semiconductor device package. The method involves calculating the standoff heights between the substrate and the semiconductor chip, which are then used to determine the volume of underfill material needed to fill the space between them. The determined volume of underfill material is then dispensed on the substrate to fill the space between the substrate and the semiconductor chip.
- The method calculates standoff heights between a substrate and a semiconductor chip.
- The calculated standoff heights are used to determine the volume of underfill material needed.
- The determined volume of underfill material is dispensed on the substrate to fill the space between the substrate and the semiconductor chip.
- This method allows for improved dispensing of underfill material in the presence of variations in standoff height.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics assembly industry
Problems solved by this technology:
- Ensures proper filling of the space between the substrate and the semiconductor chip
- Addresses variations in standoff height
Benefits of this technology:
- Improved reliability of semiconductor devices
- Enhanced performance of semiconductor devices
- Cost savings in manufacturing processes
Original Abstract Submitted
a method of dispensing an underfill material on a semiconductor device package. a substrate having a semiconductor chip electrically connected thereto and offset from the substrate by solder joints is provided. the semiconductor chip has a footprint defined by a length and width of the semiconductor chip. standoff heights between the substrate and the semiconductor chip are calculated and used to determine a volume of underfill material needed to substantially fill a space between the substrate and the semiconductor chip. the determined volume of underfill material is dispensed on the substrate such that the space between the substrate and the semiconductor chip is substantially filled by the underfill material. the method may allow for improved dispensing an underfill material to substantially fill the space between the substrate and semiconductor chip when variations in standoff height are present.
