20240038435. METHOD OF MANUFACTURING INDUCTIVE DEVICE simplified abstract (CHILISIN ELECTRONICS CORP.)

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METHOD OF MANUFACTURING INDUCTIVE DEVICE

Organization Name

CHILISIN ELECTRONICS CORP.

Inventor(s)

JUI-MIN Chung of TAOYUAN CITY (TW)

CHIA-CHEN Chen of TAOYUAN CITY (TW)

HUNG-PIN Lin of TAOYUAN CITY (TW)

METHOD OF MANUFACTURING INDUCTIVE DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240038435 titled 'METHOD OF MANUFACTURING INDUCTIVE DEVICE

Simplified Explanation

The patent application describes a method of manufacturing an inductive device, which involves the following steps:

  • Providing a magnetic base with a core column and a positioning trench surrounding the core column.
  • Forming a coil structure consisting of a coil body, a first extending section, and a second extending section. The coil body has a through hole, the first extending section has a first bent portion and a first terminal portion, and the second extending section has a second bent portion and a second terminal portion.
  • Arranging the coil structure in the positioning trench by sleeving the coil body around the core column.
  • Forming a package structure to cover the magnetic base and the coil structure.

Potential applications of this technology:

  • Inductive devices are widely used in various electronic systems, such as power supplies, wireless charging systems, and communication devices. This method of manufacturing can be applied to produce inductive devices for these applications.

Problems solved by this technology:

  • The positioning trench in the magnetic base helps to accurately position and secure the coil structure, ensuring proper alignment and efficient operation of the inductive device.
  • The through hole in the coil body allows for easy insertion of the core column, simplifying the manufacturing process.

Benefits of this technology:

  • The method provides a simplified and efficient way of manufacturing inductive devices.
  • The accurate positioning of the coil structure ensures optimal performance of the inductive device.
  • The through hole in the coil body simplifies the assembly process, reducing manufacturing time and cost.


Original Abstract Submitted

a method of manufacturing an inductive device includes: providing a magnetic base including a core column and defining a positioning trench that surrounds the core column; forming a coil structure including a coil body, a first extending section, and a second extending section, in which the coil body has a through hole, the first extending section includes a first bent portion and a first terminal portion connected thereto, and the second extending section includes a second bent portion and a second terminal portion connected thereto; arranging the coil structure in the positioning trench by sleeving the coil body around the core column; and forming a package structure to cover the magnetic base and the coil structure.

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