20240036010. ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM simplified abstract (Hitachi Power Solutions Co., Ltd.)
Contents
ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM
Organization Name
Hitachi Power Solutions Co., Ltd.
Inventor(s)
Masayuki Kobayashi of Tokyo (JP)
Natsuki Sugaya of Ibaraki (JP)
Koutaro Kikukawa of Ibaraki (JP)
ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240036010 titled 'ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM
Simplified Explanation
The ultrasonic inspection device and method described in the patent application aim to generate a clear image of a desired bonding interface without an S-gate. The device includes a controller that performs several steps to achieve this:
- The controller defines a first gate, indicating a time range, to extract a part of a reflected wave based on a predetermined condition.
- The controller also defines one or more second gates, each indicating a time width smaller than that of the first gate, before the end time of the first gate.
- For each measurement point of the inspection object, the device detects a lower layer echo or a local peak and adjusts the reception time of the reflected wave based on this information.
- Finally, the device generates a cross-sectional image of the inspection object based on the reflected wave.
Potential applications of this technology:
- Non-destructive testing and inspection of bonding interfaces in various industries such as aerospace, automotive, and manufacturing.
- Quality control and assurance in the production of bonded components.
- Detection and analysis of defects or anomalies in bonding interfaces.
Problems solved by this technology:
- Overcoming the limitations of conventional ultrasonic inspection methods that rely on S-gates, which can result in unclear or distorted images of bonding interfaces.
- Providing a more accurate and reliable inspection technique for bonding interfaces without the need for S-gates.
- Enhancing the ability to detect and analyze defects or anomalies in bonding interfaces.
Benefits of this technology:
- Improved image quality and clarity of bonding interfaces, leading to better analysis and interpretation of inspection results.
- Increased efficiency and accuracy in the inspection process, reducing the need for rework or additional inspections.
- Enhanced reliability and confidence in the quality of bonding interfaces, ensuring the integrity and performance of bonded components.
Original Abstract Submitted
provided is an ultrasonic inspection device and method capable of generating a clear image of a desired bonding interface without an s-gate. the controller in the ultrasonic inspection device is configured to: (a) define a first gate indicating a time range in which a part of a reflected wave is extracted based on a predetermined condition received; (b) define one or more second gates each indicating a time width smaller than that of the first gate before an end time of the first gate; (c) for each of a plurality of measurement points of an inspection object, (c1) detect a lower layer echo or a local peak, (c2) adjust a reception time of the reflected wave based on the lower layer echo or the local peak; and (d) generate a cross-sectional image of the inspection object based on the reflected wave.
