20240033766. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240033766 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The abstract describes a substrate processing apparatus that includes a substrate holder, a rotational driver, and an ejection part. The ejection part is responsible for ejecting a processing liquid towards a liquid landing point on the substrate. The ejection part consists of multiple nozzles that are different from each other in at least one of a first angle or a second angle. The first angle is defined as the angle formed by a straight line connecting the foot of a perpendicular line from the ejection point to the substrate and the liquid landing point, and a tangential line to a defined circle at the liquid landing point. The second angle is defined as the angle formed by the straight line connecting the ejection point and the liquid landing point, and another straight line.
- The substrate processing apparatus includes a substrate holder, rotational driver, and ejection part.
- The ejection part has multiple nozzles that differ in at least one angle.
- The first angle is formed by a straight line connecting the foot of a perpendicular line from the ejection point to the substrate and the liquid landing point, and a tangential line to a defined circle at the liquid landing point.
- The second angle is formed by the straight line connecting the ejection point and the liquid landing point, and another straight line.
Potential applications of this technology:
- Semiconductor manufacturing: The substrate processing apparatus can be used in the production of semiconductors, where precise ejection of processing liquids onto substrates is crucial.
- Display manufacturing: This technology can be applied in the production of displays, such as LCD or OLED screens, to ensure accurate deposition of liquid materials.
- Solar panel production: The substrate processing apparatus can be utilized in the manufacturing of solar panels, where controlled application of processing liquids is necessary.
Problems solved by this technology:
- Uniform liquid deposition: The different angles of the nozzles allow for more precise and uniform ejection of processing liquids onto the substrate, ensuring consistent and high-quality results.
- Reduced processing time: The rotational driver enables efficient rotation of the substrate holder, allowing for faster processing of substrates.
- Enhanced process control: The ability to adjust the angles of the nozzles provides greater control over the direction and distribution of the processing liquid, improving overall process control.
Benefits of this technology:
- Improved product quality: The precise and uniform deposition of processing liquids leads to higher quality substrates with fewer defects.
- Increased productivity: The faster processing time achieved through the rotational driver enhances productivity and throughput in substrate manufacturing.
- Enhanced process flexibility: The adjustable angles of the nozzles offer flexibility in adapting the substrate processing apparatus to different types of substrates and liquid materials.
Original Abstract Submitted
a substrate processing apparatus includes a substrate holder, a rotational driver configured to rotate the substrate holder, and an ejection part configured to eject a processing liquid toward a liquid landing point of the substrate. the ejection part includes a plurality of nozzles that is different from each other in at least one of a first angle � or a second angle �. a circle is defined. an angle formed by a straight line, which interconnects a foot of a perpendicular line from an ejection point of the processing liquid to the substrate and the liquid landing point, and a tangential line to the circle at the liquid landing point is defined as a first angle �, and an angle formed by that straight line and a straight line, which interconnects the ejection point and the liquid landing point, is defined as a second angle �.
