20240032286. INTEGRATED CIRCUIT DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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INTEGRATED CIRCUIT DEVICES

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Chansic Yoon of Suwon-si (KR)

Jongmin Kim of Suwon-si (KR)

Kiseok Lee of Suwon-si (KR)

Junhyeok Ahn of Suwon-si (KR)

INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240032286 titled 'INTEGRATED CIRCUIT DEVICES

Simplified Explanation

The abstract describes an integrated circuit device that includes various components such as a substrate, active region, word line, bit line, direct contact, pad, buried contact, and conductive landing pad. These components are arranged in a specific configuration to achieve certain functionalities.

  • The integrated circuit device includes a substrate with an active region defined by a trench isolation.
  • A word line extends horizontally inside the substrate across the active region.
  • A bit line extends on the word line in a horizontal direction orthogonal to the first direction.
  • A direct contact electrically connects the bit line to the active region.
  • A pad is located on the active region and has a greater horizontal width than the active region itself.
  • A buried contact contacts a sidewall of the pad.
  • A conductive landing pad extends vertically on the buried contact and faces the bit line in the first horizontal direction.

Potential applications of this technology:

  • This integrated circuit device can be used in various electronic devices such as smartphones, computers, and IoT devices.
  • It can be utilized in memory devices, processors, and other integrated circuits that require efficient electrical connections.

Problems solved by this technology:

  • The direct contact and buried contact provide efficient electrical connections between the bit line and the active region, improving the overall performance of the integrated circuit device.
  • The pad with a larger horizontal width allows for easier access and connection to the active region.

Benefits of this technology:

  • Improved electrical connectivity between the bit line and the active region leads to enhanced performance and functionality of the integrated circuit device.
  • The configuration of the components allows for efficient use of space on the substrate, optimizing the design and layout of the integrated circuit device.


Original Abstract Submitted

provided is an integrated circuit device including a substrate that includes an active region defined by a trench isolation, a word line that extends in a first horizontal direction inside the substrate across the active region, a bit line that extends on the word line in a second horizontal direction orthogonal to the first horizontal direction, a direct contact that electrically connects the bit line to the active region, a pad that is on the active region and has a horizontal width that is greater than that of the active region, a buried contact that contacts a sidewall of the pad, and a conductive landing pad that extends on the buried contact in a vertical direction and faces the bit line in the first horizontal direction.