20240032249. FOLDED-FIN VAPOR CHAMBER COLD PLATE simplified abstract (HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP)

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FOLDED-FIN VAPOR CHAMBER COLD PLATE

Organization Name

HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor(s)

Steven Dean of Chippewa Falls WI (US)

Ernesto J. Ferrer of Aguadilla (PR)

John Paul Franz of Tomball TX (US)

Laura Malcotti-sanchez of Houston TX (US)

FOLDED-FIN VAPOR CHAMBER COLD PLATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240032249 titled 'FOLDED-FIN VAPOR CHAMBER COLD PLATE

Simplified Explanation

The abstract describes a heat removal apparatus that consists of a vapor chamber device and a cover. The vapor chamber device includes a base and a folded fin structure, which together form a vapor chamber containing a wick and a working fluid. The cover and the vapor chamber device create a liquid chamber for receiving liquid coolant. The folded fin structure has grooves on both sides, with one set of grooves forming part of the vapor chamber and the other set forming part of the liquid chamber.

  • The heat removal apparatus includes a vapor chamber device and a cover.
  • The vapor chamber device has a base and a folded fin structure.
  • The base and folded fin structure create a vapor chamber with a wick and working fluid.
  • The cover and vapor chamber device form a liquid chamber for liquid coolant.
  • The folded fin structure has grooves on both sides, with one set of grooves forming part of the vapor chamber and the other set forming part of the liquid chamber.

Potential applications of this technology:

  • Cooling systems for electronic devices such as computers, servers, and mobile devices.
  • Thermal management in automotive systems, including electric vehicles.
  • Heat dissipation in industrial machinery and equipment.
  • Cooling solutions for medical devices and equipment.
  • Thermal control in aerospace and aviation systems.

Problems solved by this technology:

  • Efficient heat removal from electronic components, preventing overheating and potential damage.
  • Improved thermal management in various applications, ensuring optimal performance and reliability.
  • Reduction of energy consumption by maintaining lower operating temperatures.
  • Enhanced cooling capabilities in compact and space-constrained systems.
  • Prevention of thermal throttling and performance degradation.

Benefits of this technology:

  • Effective heat dissipation, allowing for higher power densities and improved performance.
  • Compact and lightweight design, enabling integration into various devices and systems.
  • Versatile and adaptable to different cooling requirements and configurations.
  • Reliable and long-lasting cooling solution, reducing the risk of component failure.
  • Energy-efficient operation, contributing to overall system efficiency and sustainability.


Original Abstract Submitted

a heat removal apparatus may comprise a vapor chamber device and a cover coupled to the vapor chamber device. the vapor chamber device comprises a base, a folded fin structure coupled to the base, with the base and folded fin structure defining a vapor chamber containing a wick and a working fluid. the cover and the vapor chamber device define a liquid chamber configured to receive liquid coolant. the folded fin structure comprises a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and defining a second plurality of grooves on a second side of the folded fin structure. the first plurality of grooves are part of the vapor chamber. the second plurality of grooves are part of the liquid chamber.

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