20240032222. BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Moohyun Baek of Suwon-si, Gyeonggi-do (KR)

Daeyoung Noh of Suwon-si, Gyeonggi-do (KR)

BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240032222 titled 'BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Simplified Explanation

The abstract describes an electronic device that includes a frame module enclosing a space between two surface plates. The frame module consists of a bracket, an outer cover, and a buffer groove filled with a buffer member.

  • The electronic device includes a frame module that encloses a space between two surface plates.
  • The frame module consists of a bracket, an outer cover, and a buffer groove.
  • The bracket has a bracket end surface.
  • The outer cover has a first cover surface and a second cover surface.
  • The buffer groove defines a space between the bracket end surface and a portion of the second cover surface.
  • The buffer groove is filled with a buffer member made of a buffer material.

Potential applications of this technology:

  • Electronic devices with improved structural integrity and protection.
  • Devices requiring a buffer to absorb shocks or vibrations.
  • Devices with a need for a secure enclosure.

Problems solved by this technology:

  • Provides a protective frame module to enclose and safeguard the space between surface plates.
  • Reduces the risk of damage from external impacts or vibrations.
  • Enhances the overall durability and stability of the electronic device.

Benefits of this technology:

  • Improved protection for sensitive components within the electronic device.
  • Increased resistance to external shocks or vibrations.
  • Enhanced structural integrity and longevity of the device.


Original Abstract Submitted

an electronic device includes: a first surface plate, a second surface plate positioned on a side opposite to the first surface plate, and a frame module including a frame enclosing at least a portion of a space formed between the first surface plate and the second surface plate. the frame module includes a bracket having a bracket end surface, an outer cover comprising a first cover surface and a second cover surface opposite to the first cover surface, and enclosing the bracket, and a buffer groove defining a space between the bracket end surface of the bracket and at least a portion of the second cover surface of the outer cover which face each other, and the buffer groove is filled with a buffer member comprising a buffer material.

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