20240030619. Electronic Device With Millimeter Wave Antenna Module simplified abstract (Honor Device Co., Ltd.)

From WikiPatents
Jump to navigation Jump to search

Electronic Device With Millimeter Wave Antenna Module

Organization Name

Honor Device Co., Ltd.

Inventor(s)

Yu Wang of Shenzhen (CN)

Zengchao Qu of Shenzhen (CN)

Electronic Device With Millimeter Wave Antenna Module - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240030619 titled 'Electronic Device With Millimeter Wave Antenna Module

Simplified Explanation

The abstract describes an electronic device with a millimeter wave antenna module that includes a circuit board, a back cover, and the millimeter wave antenna module. The module is placed on the circuit board facing the back cover and is designed to transmit a millimeter wave signal. The back cover or the circuit board is equipped with an in-phase reflection structure, which ensures that the phase of the millimeter wave signal received by the structure is the same as that of the reflected millimeter wave signal. The millimeter wave signal sent by the antenna module is reflected multiple times between the circuit board and the back cover, resulting in a distance between them that satisfies the condition of having the same phase for each reflected signal reaching the back cover.

  • The electronic device has a millimeter wave antenna module that transmits millimeter wave signals.
  • The module is placed on the circuit board facing the back cover.
  • The back cover or the circuit board is equipped with an in-phase reflection structure.
  • The in-phase reflection structure ensures that the phase of the received millimeter wave signal is the same as that of the reflected signal.
  • The millimeter wave signal is reflected multiple times between the circuit board and the back cover.
  • The distance between the circuit board and the back cover is adjusted to maintain the same phase for each reflected signal reaching the back cover.
  • The inclusion of the in-phase reflection structure reduces the thickness of the electronic device.
  • The radiation performance of the antenna is improved.

Potential applications of this technology:

  • Mobile devices with millimeter wave antennas, such as smartphones and tablets.
  • Wireless communication devices operating in the millimeter wave frequency range.
  • Internet of Things (IoT) devices that require high-speed data transmission.

Problems solved by this technology:

  • Ensures that the millimeter wave signal maintains the same phase during multiple reflections, improving signal quality and reliability.
  • Reduces the thickness of the electronic device, making it more compact and portable.
  • Improves the radiation performance of the antenna, leading to better signal reception and transmission.

Benefits of this technology:

  • Enhanced signal quality and reliability in millimeter wave communication.
  • Compact and portable electronic devices.
  • Improved performance of millimeter wave antennas.


Original Abstract Submitted

embodiments of this application provide an electronic device with a millimeter wave antenna module, including a circuit board, a back cover, and a millimeter wave antenna module. the millimeter wave antenna module is disposed on a surface of the circuit board facing the back cover and is configured to send a millimeter wave signal. at least one of the back cover and the circuit board is disposed with an in-phase reflection structure. a phase of a millimeter wave signal received by the in-phase reflection structure is the same as that of a reflected millimeter wave signal. the millimeter wave signal sent by the millimeter wave antenna module is reflected a plurality of times between the circuit board and the back cover, so that a distance between the circuit board and the back cover satisfies that phases of a millimeter wave signal reaching the back cover each time are the same. according to this application, at least one of the back cover and the circuit board is disposed with the in-phase reflection structure, so that the phases of the millimeter wave signal reaching the back cover each time are the same when the millimeter wave signal is reflected the plurality of times between the circuit board and the back cover in a shorter distance. this reduces a thickness of the whole electronic device and improves radiation performance of an antenna.