20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
Contents
HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240030088 titled 'HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE
Simplified Explanation
The abstract describes a heat spreader assembly for a semiconductor device. It consists of a pair of locking bars mounted on a substrate, with each bar having multiple locking hooks and a slot. The assembly also includes a heat spreader body with a top portion and lateral portions, creating a space for the semiconductor die. The lateral portions have protrusion ribs that slide past the locking hooks and engage with the slots to prevent the heat spreader from moving away from the substrate.
- The heat spreader assembly is designed to secure a heat spreader to a semiconductor device.
- It includes locking bars with locking hooks and slots, as well as a heat spreader body with protrusion ribs.
- The locking hooks on the bars and the protrusion ribs on the heat spreader body work together to prevent the heat spreader from moving away from the substrate.
- This assembly ensures proper thermal management by securely attaching the heat spreader to the semiconductor device.
Potential Applications:
- This heat spreader assembly can be used in various semiconductor devices, such as microprocessors, graphics cards, and power electronics.
- It can be applied in electronic devices that require efficient heat dissipation, such as laptops, servers, and gaming consoles.
Problems Solved:
- The heat spreader assembly solves the problem of inadequate heat dissipation in semiconductor devices.
- It addresses the issue of heat spreaders becoming loose or detached from the substrate, which can lead to overheating and reduced performance.
Benefits:
- The assembly provides a secure and reliable attachment of the heat spreader to the semiconductor device, ensuring efficient heat dissipation.
- It helps to prevent thermal throttling and potential damage to the semiconductor components.
- The design allows for easy installation and removal of the heat spreader, facilitating maintenance and repair processes.
Original Abstract Submitted
provided is a heat spreader assembly comprising: a pair of locking bars mounted on a substrate of a semiconductor device and at two opposite sides of at least one semiconductor die, wherein each of the pair of locking bars comprises a plurality of locking hooks disposed along the locking bar and defines a slot; and a heat spreader comprising: a heat spreader body comprising a top portion and a pair of lateral portions, the heat spreader body defining a space for receiving the at least one semiconductor die; and a pair of protrusion ribs extending in opposite directions from the pair of lateral portions, respectively, wherein the pair of protrusion ribs is configured to slide past the locking hooks of the pair of locking bars and be engaged within the slots to prevent the heat spreader from moving away from the substrate of the semiconductor device.
