20240027038. LIGHT EMITTING DIODE ASSEMBLY AND PLANT LIGHTING FIXTURE simplified abstract (HANGZHOU HPWINNER OPTO CORPORATION)

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LIGHT EMITTING DIODE ASSEMBLY AND PLANT LIGHTING FIXTURE

Organization Name

HANGZHOU HPWINNER OPTO CORPORATION

Inventor(s)

Jianming Huang of Hangzhou (CN)

Kai Chen of Hangzhou (CN)

LIGHT EMITTING DIODE ASSEMBLY AND PLANT LIGHTING FIXTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240027038 titled 'LIGHT EMITTING DIODE ASSEMBLY AND PLANT LIGHTING FIXTURE

Simplified Explanation

The abstract describes an LED assembly that includes a substrate, an LED module, and a lens plate. The lens plate has a lens portion that creates a space between its inner surface and the LED module. This space is filled with a filler material that has a higher refractive index than air. The LED module consists of a chip holder, a red LED chip, and an optical encapsulant covering the top surface of the LED chip. The LED module is a plastic leaded chip carrier package. The refractive index of the filler material is preferably different from the refractive index of the optical encapsulant by no more than 0.3.

  • The LED assembly includes a substrate, LED module, and lens plate.
  • The lens plate has a lens portion that creates a space between it and the LED module.
  • The space is filled with a filler material with a higher refractive index than air.
  • The LED module consists of a chip holder, red LED chip, and optical encapsulant.
  • The LED module is a plastic leaded chip carrier package.
  • The refractive index of the filler material is close to that of the optical encapsulant.

Potential Applications:

  • Lighting fixtures: The LED assembly can be used in various lighting fixtures, such as bulbs, lamps, and downlights.
  • Automotive lighting: The LED assembly can be applied in headlights, taillights, and other automotive lighting applications.
  • Display technology: The LED assembly can be utilized in displays, signage, and screens.

Problems Solved:

  • Improved light output: The use of a filler material with a higher refractive index helps optimize light transmission and reduce losses.
  • Enhanced optical performance: The lens portion and filler material contribute to better focusing and directionality of light emitted by the LED chip.
  • Efficient heat dissipation: The plastic leaded chip carrier package and substrate design aid in dissipating heat generated by the LED chip.

Benefits:

  • Increased brightness and efficiency: The optimized light transmission and improved optical performance result in brighter and more efficient LED lighting.
  • Enhanced design flexibility: The use of a plastic leaded chip carrier package allows for compact and versatile LED assembly designs.
  • Improved reliability: The efficient heat dissipation helps prolong the lifespan and reliability of the LED assembly.


Original Abstract Submitted

an led assembly includes a substrate, an led module mounted on the substrate, and a lens plate disposed on the substrate. the lens plate has a lens portion disposed atop the led module and defining a space between an inner surface of the lens portion and the led module. a filler material having a refractive index greater than air fills the space between the led module and the inner surface of the lens portion. the led module includes a chip holder mounted on the substrate, a red led chip mounted on the chip holder, and an optical encapsulant covering the top surface of the led chip. the led module is a plastic leaded chip carrier package. the refractive index of the filler material preferably differs from the refractive index of the optical encapsulant by at most �0.3.

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