20240024917. BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES simplified abstract (BFLY OPERATIONS, INC.)

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BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES

Organization Name

BFLY OPERATIONS, INC.

Inventor(s)

Lingyun Miao of Fremont CA (US)

Jianwei Liu of Fremont CA (US)

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240024917 titled 'BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES

Simplified Explanation

The abstract describes an ultrasound transducer device that includes an electrode, a membrane, a patterned membrane support layer, and vias that electrically connect the electrode to a substrate. The vias are arranged in a way that less than 50% of them overlap with the support surface of the patterned membrane support layer.

  • The ultrasound transducer device includes an electrode and a membrane separated by a cavity.
  • A patterned membrane support layer is placed between the electrode and the membrane, defining the size and shape of the cavity.
  • Vias are used to electrically connect the electrode to a substrate.
  • The vias are arranged in a way that less than 50% of them overlap with the support surface of the patterned membrane support layer.

Potential Applications:

  • Medical imaging: The ultrasound transducer device can be used in medical imaging applications to generate high-resolution images of internal organs and tissues.
  • Non-destructive testing: The device can be used for non-destructive testing in industries such as manufacturing and aerospace to detect flaws or defects in materials.

Problems Solved:

  • Improved performance: The patterned membrane support layer and the arrangement of vias help optimize the performance of the ultrasound transducer device, resulting in better image quality and sensitivity.
  • Reduced interference: By minimizing the overlap of vias with the support surface, potential interference or signal degradation is reduced, leading to more accurate and reliable ultrasound measurements.

Benefits:

  • Enhanced image quality: The device's design and arrangement contribute to improved image resolution and clarity, allowing for more accurate diagnosis and detection of abnormalities.
  • Increased reliability: The optimized performance and reduced interference enhance the reliability of the ultrasound transducer device, ensuring consistent and accurate results.
  • Versatile applications: The device can be used in various fields, including medical imaging and non-destructive testing, expanding its potential applications and market reach.


Original Abstract Submitted

an ultrasound transducer device includes an electrode, a membrane separated from the electrode by a cavity between the membrane and the electrode, a patterned membrane support layer that defines a size and shape of the cavity and that is disposed between the electrode and the membrane, and vias that electrically connect the electrode to a substrate. the vias are disposed in the ultrasound transducer device such that less than 50% of the vias overlap with a support surface of the patterned membrane support layer, in a plan view.

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