20240024916. ULTRASONIC TRANSDUCER ARRAY DEVICE simplified abstract (KATHOLIEKE UNIVERSITEIT LEUVEN)
Contents
ULTRASONIC TRANSDUCER ARRAY DEVICE
Organization Name
KATHOLIEKE UNIVERSITEIT LEUVEN
Inventor(s)
Sina Sadeghpour Shamsabadi of Lubbeek (BE)
ULTRASONIC TRANSDUCER ARRAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240024916 titled 'ULTRASONIC TRANSDUCER ARRAY DEVICE
Simplified Explanation
The abstract describes an ultrasonic transducer multilayer structure that includes a semiconductor layer stack defining a diode, and a micro-machined ultrasonic transducer (MUT) layer stack that is electrically in series with the diode. The MUT layer stack includes a first electrically conductive layer disposed on the diode and a cavity extending over a region that includes at least a portion of the semiconductor layer stack and the first electrically conductive layer. The MUT layer stack also includes a membrane that extends at least partly over this region.
- The ultrasonic transducer multilayer structure is used in a sensor apparatus for measuring at least one characteristic of an object.
- The sensor apparatus can be used in various applications such as medical imaging (cardiac imaging, obstetrics, gynaecology, abdominal imaging, intravascular imaging, and mammography), non-destructive testing (NDA), fingerprint sensors, range finders, gesture recognition, ultrasonic haptic feedback, ultrasonic communication, and MEMS speakers.
Potential applications of this technology:
- Medical imaging: The ultrasonic transducer multilayer structure can be used in various medical imaging applications, providing high-resolution imaging for cardiac imaging, obstetrics, gynaecology, abdominal imaging, intravascular imaging, and mammography.
- Non-destructive testing (NDA): The structure can be used in NDA applications to detect and analyze flaws or defects in materials without causing damage.
- Fingerprint sensors: The structure can be used in fingerprint sensors to capture high-quality fingerprint images for identification and security purposes.
- Range finders: The structure can be used in range finders to accurately measure distances by emitting and detecting ultrasonic waves.
- Gesture recognition: The structure can be used in devices that recognize and interpret hand gestures for user interaction.
- Ultrasonic haptic feedback: The structure can be used to provide tactile feedback through ultrasonic vibrations, enhancing user experience in touch-based interfaces.
- Ultrasonic communication: The structure can be used for wireless communication using ultrasonic waves, enabling secure and interference-free data transmission.
- MEMS speakers: The structure can be used in microelectromechanical systems (MEMS) speakers to produce high-quality sound with compact size and low power consumption.
Problems solved by this technology:
- High-resolution imaging: The ultrasonic transducer multilayer structure provides improved imaging capabilities, allowing for detailed visualization of objects or tissues.
- Non-destructive testing: The structure enables non-destructive evaluation of materials, reducing the need for destructive testing methods.
- Accurate distance measurement: The structure improves the accuracy of range finders, enabling precise distance measurements in various applications.
- Enhanced user interaction: The structure enables accurate and reliable gesture recognition, enhancing user interaction with devices.
- Tactile feedback: The structure provides haptic feedback through ultrasonic vibrations, enhancing the realism and usability of touch-based interfaces.
- Secure communication: Ultrasonic communication using the structure ensures secure data transmission, minimizing the risk of interception or interference.
- Compact and efficient sound production: The structure enables the development of compact and energy-efficient MEMS speakers without compromising sound quality.
Benefits of this technology:
- Improved imaging quality: The ultrasonic transducer multilayer structure enhances the quality and resolution of medical imaging, allowing for better diagnosis and treatment planning.
- Non-destructive evaluation: The structure enables non-destructive testing of materials, reducing costs and minimizing damage during inspection.
- Enhanced user experience: The structure improves user interaction with devices through accurate gesture recognition and realistic haptic feedback.
- Secure communication: Ultrasonic communication using the structure provides a secure and interference-free method for data transmission.
- Compact and efficient design: The structure allows for the development of compact and energy-efficient devices, such as fingerprint sensors, range finders, and MEMS speakers.
Original Abstract Submitted
an ultrasonic transducer multilayer structure, including: a semiconductor layer stack defining a diode, a micro-machined ultrasonic transducer, mut, layer stack being electrically in series with said diode and comprising a first electrically conductive layer disposed at least partly on the diode, a cavity extending over a region comprising at least a portion of the semiconductor layer stack and the first electrically conductive layer, wherein the mut layer stack comprises a membrane extending at least partly over said region. the ultrasonic transducer multilayer structure may be used in a sensor apparatus for measuring at least one characteristic of an object. the sensor apparatus is used for medical imaging, such as cardiac imaging, obstetrics, gynaecology, abdominal imaging, intravascular imaging, and mammography, or non-destructive testing (nda), fingerprint sensors, range finders, gesture recognition, ultrasonic haptic feedback, ultrasonic communication or mems speakers.
