20240023315. SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)

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SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Organization Name

NANYA TECHNOLOGY CORPORATION

Inventor(s)

SZU-YAO Chang of NEW TAIPEI CITY (TW)

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240023315 titled 'SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The abstract of the patent application describes a semiconductor structure and a method of manufacturing it. The structure includes a substrate, an upper structure, a vertical transistor, and an electrical pad. The upper structure is placed on the substrate and has a hole. The vertical transistor is positioned in the hole, and the electrical pad is placed in the hole on top of the vertical transistor. The top surface of the electrical pad is aligned with the topmost surface of the upper structure.

  • The semiconductor structure consists of a substrate, an upper structure, a vertical transistor, and an electrical pad.
  • The upper structure is located on the substrate and defines a hole.
  • The vertical transistor is positioned within the hole of the upper structure.
  • The electrical pad is placed in the hole and on top of the vertical transistor.
  • The top surface of the electrical pad is aligned with the topmost surface of the upper structure.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Electronics industry
  • Integrated circuit production

Problems solved by this technology:

  • Provides a compact and efficient structure for semiconductor devices
  • Ensures proper alignment and connection between the vertical transistor and the electrical pad
  • Enhances the performance and reliability of the semiconductor structure

Benefits of this technology:

  • Improved functionality and performance of semiconductor devices
  • Enhanced reliability and durability of the structure
  • Simplified manufacturing process
  • Cost-effective production of semiconductor structures


Original Abstract Submitted

a semiconductor structure and a method of manufacturing a semiconductor structure are provided. the semiconductor structure includes a substrate, an upper structure, a vertical transistor an electrical pad. the upper structure is disposed on the substrate and defines a hole. the vertical transistor is disposed in the hole. the electrical pad is disposed in the hole and on the vertical transistor. a top surface of the electrical pad is substantially aligned with a topmost surface of the upper structure.

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