20240019508. MULTI-FUNCTIONAL MAGNETIC TEST STRUCTURE FOR XMR SENSORS simplified abstract (Infineon Technologies AG)

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MULTI-FUNCTIONAL MAGNETIC TEST STRUCTURE FOR XMR SENSORS

Organization Name

Infineon Technologies AG

Inventor(s)

Christoph Schroers of Villach (AT)

Manfred Steiner of Rennweg am Katschberg (AT)

Armin Winkler of Villach (AT)

MULTI-FUNCTIONAL MAGNETIC TEST STRUCTURE FOR XMR SENSORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240019508 titled 'MULTI-FUNCTIONAL MAGNETIC TEST STRUCTURE FOR XMR SENSORS

Simplified Explanation

The abstract describes a sensor die that includes a set of sensing elements and a test structure for determining the magnetic sensitivity of the sensing elements. The test structure consists of two test sensing elements and a wire on chip (WOC) that applies a magnetic field to the test sensing elements. The first test sensing element is sensitive to a magnetic field component in a specific direction, while the second test sensing element is sensitive to a magnetic field component in a perpendicular direction.

  • The sensor die includes sensing elements and a test structure for measuring magnetic sensitivity.
  • The test structure consists of two test sensing elements and a wire on chip (WOC).
  • The first test sensing element is sensitive to a magnetic field component in a specific direction.
  • The second test sensing element is sensitive to a magnetic field component in a perpendicular direction.
  • The WOC applies a magnetic field to the test sensing elements.
  • When current flows through the WOC, the first test sensing element detects the magnetic field component in the specific direction, and the second test sensing element detects the magnetic field component in the perpendicular direction.

Potential applications of this technology:

  • Magnetic field sensing in various devices and systems.
  • Position and motion sensing in robotics and automation.
  • Magnetic navigation systems.
  • Magnetic field mapping and imaging.

Problems solved by this technology:

  • Accurate measurement of magnetic field components in different directions.
  • Determination of magnetic sensitivity of sensing elements.
  • Integration of test structures for efficient testing and calibration.

Benefits of this technology:

  • Improved accuracy and reliability of magnetic field sensing.
  • Enhanced performance of devices and systems relying on magnetic field measurements.
  • Simplified testing and calibration processes.
  • Cost-effective integration of test structures on the sensor die.


Original Abstract Submitted

a sensor die may include a set of sensing elements and a test structure associated with determining a magnetic sensitivity of the set of sensing elements. the test structure includes a first test sensing element sensitive in a direction in a plane defined by a surface of the sensor die, a second test sensing element sensitive in the direction in the plane defined by the surface of the sensor die, and a wire on chip (woc) associated with applying a magnetic field to the first test sensing element and the second test sensing element. the first test sensing element, the second test sensing element, and the woc may be arranged such that, when current flows through the woc, the first test sensing element senses a component of the magnetic field in the direction, and the second test sensing element senses a component of the magnetic field in a perpendicular direction.

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