20240015922. DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER ELECTRONIC CIRCUITS simplified abstract (Crestron Electronics, Inc.)

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DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER ELECTRONIC CIRCUITS

Organization Name

Crestron Electronics, Inc.

Inventor(s)

Mark Labosco of New City NY (US)

Sanjay Upsani of Manalapan NJ (US)

Edward Joy of Carmel NY (US)

Dario Pagano of New Providence NJ (US)

Alec Magrini of Emerson NJ (US)

DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER ELECTRONIC CIRCUITS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240015922 titled 'DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER ELECTRONIC CIRCUITS

Simplified Explanation

The abstract describes a compact combined active and passive cooling system for electronic audio-video circuitry. The system is designed to fit within a standard wall gang-box located in interior walls of structures. It utilizes convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the circuitry into the room where the gang box is located. The wall plate surface is also used to dissipate heat into the room.

  • The cooling system is compact and can fit within a standard wall gang-box.
  • It combines active and passive cooling modes to dissipate heat generated by electronic audio-video circuitry.
  • The system utilizes convection, conduction, and radiation to dissipate heat into the room.
  • The wall plate surface is used as an additional heat dissipation mechanism.

Potential applications of this technology:

  • Cooling electronic audio-video circuitry in residential or commercial buildings.
  • Cooling circuitry in home theater systems or audio-video equipment.
  • Cooling circuitry in conference rooms or multimedia centers.

Problems solved by this technology:

  • Overheating of electronic audio-video circuitry.
  • Space limitations for cooling systems in interior walls.
  • Inefficient heat dissipation in compact electronic devices.

Benefits of this technology:

  • Compact design allows for installation in standard wall gang-boxes.
  • Combined active and passive cooling modes provide efficient heat dissipation.
  • Utilizes convection, conduction, and radiation for effective cooling.
  • Wall plate surface enhances heat dissipation.
  • Helps prevent overheating and potential damage to electronic circuitry.


Original Abstract Submitted

described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the av circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. the combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the av circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

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