20240014161. CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES simplified abstract (Xilinx, Inc.)
CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES
Organization Name
Inventor(s)
Ygal Arbel of Morgan Hill CA (US)
Kenneth Ma of Cupertino CA (US)
Balakrishna Jayadev of Mountain View CA (US)
Sagheer Ahmad of Cupertino CA (US)
CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240014161 titled 'CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES
Simplified Explanation
The patent application describes a system that connects multiple dies using an interposer. Each die has a bump interface structure that is connected to the other structure through traces in the interposer. However, the bump interface structures may have different orientations or define different numbers of signals, making direct connection impossible or costly. To simplify routing, the signals in the bump interface structures are connected in a way that jumbles them. Reordering circuitry in the dies can then correct the jumbled signals.
- The system connects multiple dies using an interposer.
- Each die has a bump interface structure connected to the other structure through traces in the interposer.
- The bump interface structures may have different orientations or define different numbers of signals.
- Directly connecting corresponding signals may be impossible or costly.
- The signals in the bump interface structures are connected in a way that jumbles them.
- Reordering circuitry in the dies corrects the jumbled signals.
Potential Applications:
- Semiconductor manufacturing
- Integrated circuit design
- Electronic devices with multiple dies
Problems Solved:
- Simplifies routing in a multiple die system
- Overcomes challenges of different orientations or signal definitions in bump interface structures
- Reduces the cost of interposer design
Benefits:
- Improved connectivity between multiple dies
- Simplified routing process
- Cost-effective interposer design
Original Abstract Submitted
embodiments herein describe a multiple die system that includes an interposer that connects a first die to a second die. each die has a bump interface structure that is connected to the other structure using traces in the interposer. however, the bump interface structures may have different orientations relative to each other, or one of the interface structures defines fewer signals than the other. directly connecting the corresponding signals defined by the structures to each other may be impossible to do in the interposer, or make the interposer too costly. instead, the embodiments here simplify routing in the interposer by connecting the signals in the bump interface structures in a way that simplifies the routing but jumbles the signals. the jumbled signals can then be corrected using reordering circuitry in the dies (e.g., in the link layer and physical layer).
