20240012028. LARGE PROBE CARD FOR TESTING ELECTRONIC DEVICES AND RELATED MANUFACTURING METHOD simplified abstract (TECHNOPROBE S.P.A.)

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LARGE PROBE CARD FOR TESTING ELECTRONIC DEVICES AND RELATED MANUFACTURING METHOD

Organization Name

TECHNOPROBE S.P.A.

Inventor(s)

Flavio Maggioni of Cernusco Lombardone (LC) (IT)

LARGE PROBE CARD FOR TESTING ELECTRONIC DEVICES AND RELATED MANUFACTURING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240012028 titled 'LARGE PROBE CARD FOR TESTING ELECTRONIC DEVICES AND RELATED MANUFACTURING METHOD

Simplified Explanation

The abstract describes a method of manufacturing a probe card used for functionality testing of devices under test (DUT). The method involves several steps including providing an interface board for connecting the probe card to a testing apparatus, providing a stiffener, connecting an interposer (a monobloc of material) to the stiffener, cutting the interposer according to a predetermined pattern to define multiple independent modules, associating the interface board with the stiffener, and associating a probe head with the interposer. The probe head includes contact elements that electrically connect the interposer to contact pads of the DUT. The abstract also mentions that a probe card obtained through this method is disclosed.

  • The method involves providing an interface board for connecting the probe card to a testing apparatus.
  • A stiffener is provided to support the interposer.
  • An interposer, in the shape of a monobloc of material, is connected to the stiffener.
  • The interposer is cut according to a predetermined pattern to define multiple independent modules.
  • The interface board is associated with the stiffener.
  • A probe head, which includes contact elements, is associated with the interposer.
  • The contact elements of the probe head electrically connect the interposer to contact pads of the devices under test.
  • The method results in the production of a probe card.

Potential applications of this technology:

  • Functionality testing of devices under test (DUT) in various industries such as semiconductor, electronics, and telecommunications.
  • Quality control and performance testing of electronic components and devices.

Problems solved by this technology:

  • Provides a method for manufacturing a probe card that allows for efficient and accurate functionality testing of devices under test.
  • Enables the independent and separated arrangement of multiple modules, improving the flexibility and adaptability of the probe card.

Benefits of this technology:

  • Improved accuracy and reliability in functionality testing of devices under test.
  • Enhanced flexibility and adaptability due to the independent module arrangement.
  • Cost-effective manufacturing method for probe cards.
  • Potential for increased productivity and efficiency in testing processes.


Original Abstract Submitted

a method of manufacturing a probe card for functionality testing of devices under test (dut) is disclosed having the steps of providing an interface board configured for interfacing the probe card to a testing apparatus, providing a stiffener, connecting an interposer in the shape of a monobloc of material to the stiffener, cutting the monobloc according to a predetermined pattern after connecting it to the stiffener, thereby defining a plurality of modules which are independent and separated from each other, associating the interface board with the stiffener, and associating a probe head with the interposer. the probe head includes a plurality of contact elements adapted to electrically connect the interposer to contact pads of the devices under test. a probe card obtained by the method is also disclosed.

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