20240010544. METHODS FOR DRILLING FEATURES IN A SUBSTRATE USING LASER PERFORATION AND LASER ABLATION simplified abstract (CORNING INCORPORATED)

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METHODS FOR DRILLING FEATURES IN A SUBSTRATE USING LASER PERFORATION AND LASER ABLATION

Organization Name

CORNING INCORPORATED

Inventor(s)

Maximilian Joachim Gustav Breitwieser of Munich (DE)

Andreas Simon Gaab of Corning NY (US)

METHODS FOR DRILLING FEATURES IN A SUBSTRATE USING LASER PERFORATION AND LASER ABLATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240010544 titled 'METHODS FOR DRILLING FEATURES IN A SUBSTRATE USING LASER PERFORATION AND LASER ABLATION

Simplified Explanation

The abstract describes a method of drilling a feature in a substrate using a combination of pulsed laser beams. The method involves directing a pulsed laser beam focal line into the substrate at multiple locations, creating perforations that extend through the substrate. Then, a focused ablation laser beam is directed into the substrate to remove material within the shape defined by the perforation contour, forming the desired feature. The offset between the perforation contour and the ablation track ensures that the feature has a chipping with chips smaller than 50 μm.

  • The method involves using pulsed laser beams to create perforations in a substrate and then removing material within the perforation contour to form a feature.
  • The perforation-ablation offset ensures that the feature has small chips.
  • The size of the chips produced by the method is less than 50 μm.

Potential Applications:

  • Microfabrication processes
  • Precision drilling in materials such as metals, ceramics, or semiconductors
  • Manufacturing of microelectronics, microfluidic devices, or medical implants

Problems Solved:

  • Provides a method for drilling features in substrates with reduced chipping
  • Enables precise and controlled removal of material within a defined shape

Benefits:

  • Improved accuracy and precision in drilling features
  • Reduced chipping and damage to the substrate
  • Enhanced control over the size and shape of the drilled feature


Original Abstract Submitted

in one embodiment, a method of drilling a feature in a substrate includes directing a pulsed laser beam focal line into the substrate at a plurality of locations, the laser beam focal line generating an induced absorption within the substrate such that the laser beam focal line produces a perforation extending through a thickness of the substrate at the plurality of locations to form a perforation contour. the method further includes directing a focused ablation laser beam into the substrate and ablating at least a portion of the substrate along an ablation track that is offset from the perforation contour by a perforation-ablation offset �to remove substrate material within a shape defined by the perforation contour to form the feature. the perforation-ablation offset �is such that the feature has a chipping with chips having a size of less than 50 �m.

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