18547977. ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Dongjin Jung of Gyeonggi-do (KR)

Chanju Park of Gyeonggi-do (KR)

Jungi Jeong of Gyeonggi-do (KR)

Taeksun Kwon of Gyeonggi-do (KR)

Jungwoo Seo of Gyeonggi-do (KR)

Junhwa Oh of Gyeonggi-do (KR)

ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18547977 titled 'ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME

Simplified Explanation

The abstract describes an antenna module comprising two layers with etching regions, via pads, via holes, and dividing lines connecting the via pads.

  • The antenna module includes a first layer with a first etching region, a first via pad, and a first via hole, as well as a second layer with a second etching region, multiple second via pads, second via holes, and second dividing lines connecting the second via pads.

Potential Applications

The antenna module can be used in various wireless communication devices such as smartphones, tablets, laptops, and IoT devices.

Problems Solved

1. Improved signal reception and transmission due to the efficient design of the antenna module. 2. Reduction in interference and noise in wireless communication systems.

Benefits

1. Enhanced performance of wireless devices. 2. Compact size and space-saving design. 3. Cost-effective manufacturing process.

Potential Commercial Applications

Optimized Antenna Module Design for Enhanced Wireless Communication

Possible Prior Art

Prior art related to antenna modules with multiple layers and via pads for improved signal transmission and reception.

Unanswered Questions

How does the antenna module perform in different environmental conditions?

The article does not provide information on the performance of the antenna module in varying environmental conditions such as temperature, humidity, and interference.

What is the manufacturing process for the antenna module?

The article does not detail the specific manufacturing process for producing the antenna module with the described features.


Original Abstract Submitted

An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.