18547344. SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE simplified abstract (Sony Group Corporation)
Contents
- 1 SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE
Organization Name
Inventor(s)
KOICHI Takeuchi of KANAGAWA (JP)
SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18547344 titled 'SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE
Simplified Explanation
The abstract describes a semiconductor substrate and a method for manufacturing it, as well as an electronic device including the substrate. The innovation aims to prevent bubble formation in a resist due to air expansion in an opening of a through hole and reduce defects in plating during subsequent processes.
- Prevents bubble formation in a resist due to air expansion in a through hole opening
- Reduces defects in plating during subsequent processes
Potential Applications
The technology can be applied in the manufacturing of various electronic devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
1. Bubble formation in a resist due to air expansion in a through hole opening 2. Defects in plating during subsequent processes
Benefits
1. Improved quality of semiconductor substrates 2. Enhanced reliability of electronic devices 3. Cost-effective manufacturing process
Potential Commercial Applications
"Semiconductor Substrate Manufacturing Method for Bubble Prevention" can find applications in the semiconductor industry, electronics manufacturing, and research institutions.
Possible Prior Art
There may be prior art related to methods for preventing bubble formation in resist materials during semiconductor manufacturing processes. However, specific details on prior art are not provided in this context.
Unanswered Questions
How does this technology compare to existing methods for bubble prevention in semiconductor manufacturing processes?
The article does not provide a direct comparison between this technology and existing methods for bubble prevention in semiconductor manufacturing processes.
What specific electronic devices can benefit the most from this innovation?
The article does not specify which electronic devices can benefit the most from the semiconductor substrate manufacturing method described.
Original Abstract Submitted
Provided are a semiconductor substrate, a manufacturing method for a semiconductor substrate, and an electronic device including the semiconductor substrate, which are capable of preventing bubble formation of a resist due to expansion of air in an opening portion of a through hole and reducing a defect in plating which is a subsequent process.
