18545180. Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract (Micron Technology, Inc.)

Integrated Assemblies and Methods of Forming Integrated Assemblies

Organization Name

Micron Technology, Inc.

Inventor(s)

David K. Hwang of Boise ID (US)

Richard J. Hill of Boise ID (US)

Gurtej S. Sandhu of Boise ID (US)

Integrated Assemblies and Methods of Forming Integrated Assemblies - A simplified explanation of the abstract

This abstract first appeared for US patent application 18545180 titled 'Integrated Assemblies and Methods of Forming Integrated Assemblies

Simplified Explanation

The integrated assembly described in the patent application includes container-shaped structures with source/drain regions and channel regions, as well as second conductive structures with gate regions adjacent to the channel regions. Storage elements are also present and are electrically coupled with the upper source/drain regions.

• First conductive structures extend along a first direction.
• Spaced-apart container-shaped structures are positioned over the first conductive structures.
• Each container shape has lower source/drain regions, upper source/drain regions, and a channel region.
• Second conductive structures extend along a second direction crossing the first direction.
• Storage elements are electrically coupled with the upper source/drain regions.

Potential Applications

This technology could be applied in:

• Semiconductor manufacturing
• Integrated circuit design
• Memory storage devices

Problems Solved

This technology helps to:

• Improve the efficiency of integrated circuits
• Enhance the performance of memory storage devices

Benefits

The benefits of this technology include:

• Increased speed and reliability of electronic devices
• Higher storage capacity in memory devices

Potential Commercial Applications

The potential commercial applications of this technology could be in:

• Consumer electronics
• Automotive electronics
• Telecommunications industry

Possible Prior Art

One possible prior art for this technology could be:

• Integrated circuit structures with similar container-shaped designs and conductive structures.

How does this technology impact energy consumption in electronic devices?

This article does not provide information on the energy efficiency of devices utilizing this technology. Further research may be needed to understand the impact on energy consumption.

What are the potential scalability limitations of this technology?

The article does not address the scalability limitations of this technology. Future studies could investigate the scalability of this innovation for different applications and industries.

Original Abstract Submitted

Some embodiments include an integrated assembly having first conductive structures extending along a first direction. Spaced-apart upwardly-opening container-shapes are over the first conductive structures. Each of the container-shapes has a first sidewall region, a second sidewall region, and a bottom region extending from the first sidewall region to the second sidewall region. Each of the first and second sidewall regions includes a lower source/drain region, an upper source/drain region, and a channel region between the upper and lower source/drain regions. The lower source/drain regions are electrically coupled with the first conductive structures. Second conductive structures extend along a second direction which crosses the first direction. The second conductive structures have gate regions operatively adjacent the channel regions. Storage elements are electrically coupled with the upper source/drain regions. Some embodiments include methods of forming integrated assemblies.