18537885. LASER MODULE simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)

From WikiPatents
Jump to navigation Jump to search

LASER MODULE

Organization Name

Panasonic Intellectual Property Management Co., Ltd.

Inventor(s)

MITSUOKI Hishida of Gifu (JP)

LASER MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18537885 titled 'LASER MODULE

Simplified Explanation

In a patent application, a plurality of recesses is formed in a surface of a first block, facing a second block. The recesses are in a different region from where a laser element is placed. Each recess has a spacer member with insulation properties that partly protrudes from the recess and is sandwiched between the two blocks.

  • The patent application describes a structure with recesses and spacer members for insulation.
  • The recesses are formed in a specific region on the surface of the first block, away from the laser element.
  • Spacer members with insulation properties are placed in each recess, protruding partially and sandwiched between the two blocks.

Potential Applications

The technology described in this patent application could be applied in:

  • Semiconductor manufacturing
  • Optoelectronic device fabrication
  • High-precision laser systems

Problems Solved

This technology helps in:

  • Preventing heat transfer between the two blocks
  • Ensuring proper insulation for sensitive components
  • Enhancing the overall performance and reliability of the system

Benefits

The benefits of this technology include:

  • Improved thermal management
  • Enhanced system stability
  • Increased lifespan of components

Potential Commercial Applications

This technology has potential commercial applications in:

  • Laser cutting and engraving machines
  • Fiber optic communication systems
  • Medical laser equipment

Possible Prior Art

One possible prior art for this technology could be:

  • Insulation materials used in electronic devices
  • Thermal management solutions in semiconductor industry

Unanswered Questions

How does the spacer member design impact the overall thermal conductivity of the system?

The patent application does not provide specific details on the thermal conductivity properties of the spacer member design.

Are there any specific manufacturing processes mentioned for creating the recesses and spacer members?

The patent application does not mention any specific manufacturing processes for creating the recesses and spacer members.


Original Abstract Submitted

A plurality of recesses () is formed in a surface of first block (), the surface facing second block (). The plurality of recesses () are formed in a region different from a region in which laser element () is disposed when viewed from a direction in which first block () and second block () are stacked. Each of recesses () is provided with a spacer member () having insulation properties. Spacer member () partly protrudes from corresponding recess (). Spacer member () is sandwiched between first block () and second block ().