18537703. APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM simplified abstract (Intel Corporation)
Contents
- 1 APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM
Organization Name
Inventor(s)
Akhilesh S. Thyagaturu of Ruskin FL (US)
Francesc Guim Bernat of Barcelona (ES)
Karthik Kumar of Chandler AZ (US)
Marek Piotrowski of Pepowo (PL)
APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18537703 titled 'APPLICATION CONTROL OF POWER CONFIGURATION AND THERMAL CONFIGURATION OF INFORMATION SYSTEMS PLATFORM
Simplified Explanation
The abstract describes a method that involves invoking API functions to determine the cooling states of different cooling devices in a hardware platform, orchestrating concurrent execution of multiple applications based on these states, and sending commands to change cooling states as needed.
- The method involves invoking API functions to determine the current cooling states of various cooling devices in a hardware platform.
- It orchestrates the concurrent execution of multiple applications based on the cooling states of the devices.
- Prior to the concurrent execution of applications, commands are sent to change the cooling state of at least one cooling device on the hardware platform.
Potential Applications
This technology could be applied in:
- Data centers to optimize cooling for different components.
- High-performance computing environments to manage heat dissipation efficiently.
Problems Solved
This technology addresses:
- Overheating issues in hardware platforms.
- Inefficient cooling management for multiple applications running concurrently.
Benefits
The benefits of this technology include:
- Improved performance and reliability of hardware components.
- Energy efficiency by optimizing cooling based on actual requirements.
Potential Commercial Applications
Potential commercial applications of this technology include:
- Server and data center management systems.
- High-performance computing solutions for research and scientific applications.
Possible Prior Art
One possible prior art could be:
- Existing cooling management systems in data centers and server environments.
Unanswered Questions
How does this method handle dynamic changes in cooling requirements during the concurrent execution of applications?
The method may include algorithms to dynamically adjust cooling states based on real-time data and application demands.
What is the impact of changing cooling states on the overall energy consumption of the hardware platform?
The method may need to consider the trade-off between cooling efficiency and energy consumption to optimize performance.
Original Abstract Submitted
A method is described. The method includes invoking one of more functions from a set of API functions that expose the current respective cooling states of different, respective cooling devices for different components of a hardware platform. The method includes orchestrating concurrent execution of multiple applications on the hardware platform in view of the current respective cooling states. The method includes, in order to prepare the hardware platform for the concurrent execution of the multiple applications, prior to the concurrent execution of the multiple applications, sending one or more commands to the hardware platform to change a cooling state of at least one of the cooling devices.
