18526963. BUS CAPACITOR AND AUTOMOBILE simplified abstract (BYD COMPANY LIMITED)
Contents
- 1 BUS CAPACITOR AND AUTOMOBILE
BUS CAPACITOR AND AUTOMOBILE
Organization Name
Inventor(s)
Alain Yves Louis of Shenzhen (CN)
BUS CAPACITOR AND AUTOMOBILE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18526963 titled 'BUS CAPACITOR AND AUTOMOBILE
Simplified Explanation
The bus capacitor described in the patent application consists of multiple capacitor layers stacked along the thickness direction of the capacitor, with a dielectric material filled between adjacent layers. The capacitor includes both positive and negative capacitor layers, with conductive members in holes running through the positive and negative layers to electrically connect them.
- Multiple capacitor layers stacked along the thickness direction
- Dielectric material filled between adjacent capacitor layers
- Positive and negative capacitor layers present
- Conductive members in holes running through positive and negative layers to connect them
Potential Applications
The technology described in this patent application could be used in various electronic devices and systems where capacitors are required, such as power supplies, inverters, and electric vehicles.
Problems Solved
This technology solves the problem of efficiently connecting multiple capacitor layers in a bus capacitor, ensuring proper electrical connectivity and performance.
Benefits
The benefits of this technology include improved electrical performance, increased reliability, and potentially reduced size and weight of the bus capacitor.
Potential Commercial Applications
- "Innovative Bus Capacitor Technology for Enhanced Electrical Systems"
Possible Prior Art
There may be prior art related to bus capacitors with similar stacking configurations and methods of electrical connection, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology compare to traditional bus capacitor designs in terms of performance and efficiency?
The patent application does not provide a direct comparison with traditional bus capacitor designs, so it is unclear how this technology stacks up against existing solutions.
Are there any limitations or drawbacks to implementing this technology in practical applications?
The patent application does not mention any limitations or drawbacks of the described bus capacitor technology, leaving room for further exploration of potential challenges in real-world use.
Original Abstract Submitted
A bus capacitor includes: multiple capacitor layers stacked along a thickness direction of the bus capacitor, a dielectric being filled between two adjacent capacitor layers; the multiple capacitor layers including multiple positive capacitor layers and multiple negative capacitor layers; a first hole extending along the thickness direction, the first hole running through the multiple positive capacitor layers, a first conductive member disposed in the first hole, and the first conductive member being in contact with the multiple positive capacitor layers to electrically connect the multiple positive capacitor layers with each other; a second hole extending along the thickness direction, the second hole running through the multiple negative capacitor layers, a second conductive member disposed in the second hole, and the second conductive member being in contact with the multiple negative capacitor layers to electrically connect the multiple negative capacitor layers with each other.
