18526948. TECHNOLOGIES FOR LOWER DEAD SPACE VAPOR CHAMBER simplified abstract (Intel Corporation)
Contents
- 1 TECHNOLOGIES FOR LOWER DEAD SPACE VAPOR CHAMBER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TECHNOLOGIES FOR LOWER DEAD SPACE VAPOR CHAMBER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
TECHNOLOGIES FOR LOWER DEAD SPACE VAPOR CHAMBER
Organization Name
Inventor(s)
Ravishankar Srikanth of Bangalore (IN)
Vijith Halestoph R of Bengaluru (IN)
Prakash Kurma Raju of Bangalore (IN)
Ezekiel Poulose of Chotanikara (IN)
Avinash Manu Aravindan of Kerala (IN)
TECHNOLOGIES FOR LOWER DEAD SPACE VAPOR CHAMBER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18526948 titled 'TECHNOLOGIES FOR LOWER DEAD SPACE VAPOR CHAMBER
Simplified Explanation
The patent application describes techniques for creating a vapor chamber with reduced dead space by folding a sheet and sealing the edges. This design allows for a smaller footprint of the vapor chamber, providing more space for other components in electronic devices.
- The vapor chamber is formed by folding a sheet and sealing the edges.
- The folded edge takes up less space, reducing the overall footprint of the vapor chamber.
- This design allows for more space for components like the motherboard or battery, or a smaller overall form factor.
Potential Applications
The technology could be applied in various electronic devices such as smartphones, laptops, tablets, and gaming consoles to improve thermal management and optimize space utilization.
Problems Solved
1. Reduced dead space in the vapor chamber design. 2. Increased space efficiency for other components in electronic devices.
Benefits
1. Improved thermal management. 2. More space for essential components. 3. Smaller form factor for devices.
Potential Commercial Applications
"Space Optimization in Vapor Chambers for Electronic Devices"
Possible Prior Art
There may be prior art related to vapor chamber designs in electronic devices, but specific examples are not provided in this article.
Unanswered Questions
How does this technology compare to traditional vapor chamber designs in terms of thermal performance and space utilization?
The article does not provide a direct comparison between this innovative design and traditional vapor chamber designs. Further research or testing may be needed to evaluate the performance differences.
Are there any limitations or drawbacks to using this folded edge design for vapor chambers?
The article does not mention any potential limitations or drawbacks of this design. Additional information or testing may be necessary to identify any possible challenges in implementing this technology.
Original Abstract Submitted
Techniques for a vapor chamber with less dead space are disclosed. In an illustrative embodiment, a vapor chamber is formed by folding a sheet and sealing the edges. The edges seal the vapor chamber but take up a relatively large amount of space without allowing for vapor to be transported in that space. The folded edge takes up less space, reducing the overall footprint of the vapor chamber. The vapor chamber with a smaller footprint can allow for, e.g., more space for motherboard area, more space for a battery, and/or a smaller form factor overall.
