18525289. ASSYMMETRICAL DATA RATES FOR HIGH SPEED INTERCONNECTS simplified abstract (Intel Corporation)
Contents
- 1 ASSYMMETRICAL DATA RATES FOR HIGH SPEED INTERCONNECTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ASSYMMETRICAL DATA RATES FOR HIGH SPEED INTERCONNECTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ASSYMMETRICAL DATA RATES FOR HIGH SPEED INTERCONNECTS
Organization Name
Inventor(s)
Sampath Dakshinamurthy of Bangalore (IN)
Pooja Jadhav of Davanagere (IN)
Lakshmipriya Seshan of Sunnyvale CA (US)
ASSYMMETRICAL DATA RATES FOR HIGH SPEED INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18525289 titled 'ASSYMMETRICAL DATA RATES FOR HIGH SPEED INTERCONNECTS
Simplified Explanation
Embodiments described in this patent application relate to semiconductor interconnects, specifically on-package die-to-die (D2D) interconnects for memory using the Universal Chiplet Interconnect Express (UCIe) adapter or physical layer (PHY).
- On-package D2D interconnects for memory
- Utilization of the Universal Chiplet Interconnect Express (UCIe) adapter or PHY
Potential Applications
This technology could be applied in:
- High-performance computing systems
- Data centers
- Artificial intelligence and machine learning applications
Problems Solved
This technology helps in:
- Improving data transfer speeds between memory modules
- Enhancing overall system performance
- Reducing latency in data-intensive applications
Benefits
The benefits of this technology include:
- Faster data transfer rates
- Increased system efficiency
- Enhanced performance in memory-intensive tasks
Potential Commercial Applications
This technology could be commercially applied in:
- Server systems
- Supercomputers
- High-speed data processing applications
Possible Prior Art
One possible prior art for this technology could be the use of traditional interconnect technologies for memory modules in computing systems.
Unanswered Questions
How does this technology compare to existing memory interconnect solutions in terms of performance and scalability?
This article does not provide a direct comparison with existing memory interconnect solutions in terms of performance and scalability.
What are the potential challenges in implementing this technology in real-world systems, and how can they be addressed?
This article does not address the potential challenges in implementing this technology in real-world systems or how they can be addressed.
Original Abstract Submitted
Embodiments described herein may include apparatus, systems, techniques, or processes that are directed to semiconductor interconnects, such as on-package die-to-die (D2D) interconnects, for example. Specifically, embodiments herein may relate to on-package D2D interconnects for memory that use or relate to the Universal Chiplet Interconnect Express (UCIe) adapter or physical layer (PHY). Other embodiments are described and claimed.
