18524900. INTERPOSER CIRCUIT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 INTERPOSER CIRCUIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTERPOSER CIRCUIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTERPOSER CIRCUIT
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Lee D. Whetsel of Parker TX (US)
INTERPOSER CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18524900 titled 'INTERPOSER CIRCUIT
Simplified Explanation
The disclosure presents a new method and apparatus for enhancing interposers that connect stacked die assemblies to system substrates. This improvement involves integrating IEEE 1149.1 circuitry within interposers to simplify interconnect testing of digital and analog signal connections between the interposer and the system substrate. Additionally, the enhancement includes 1149.1 controlled circuitry for real-time monitoring of voltage supply, ground buses, and functional digital and analog input/output signals in the interposer. Furthermore, the improvement allows for selectively serially linking the 1149.1 circuitry in the interposer with the 1149.1 circuitry in the die of the stack.
- Simplifies interconnect testing of digital and analog signal connections
- Real-time monitoring of voltage supply, ground buses, and input/output signals
- Selectively serially linking 1149.1 circuitry in the interposer with the die of the stack
Potential Applications
The technology could be applied in semiconductor manufacturing, electronic testing, and system integration industries.
Problems Solved
1. Simplifies testing and monitoring of signal connections 2. Enhances the efficiency of interposer functionality
Benefits
1. Improved testing capabilities 2. Real-time monitoring for better performance optimization
Potential Commercial Applications
"Enhancing Interposers with IEEE 1149.1 Circuitry for Improved Testing and Monitoring" could find applications in the semiconductor testing equipment market.
Possible Prior Art
There may be prior art related to interposer testing and monitoring technologies in the semiconductor industry.
Unanswered Questions
How does this technology impact the overall cost of manufacturing stacked die assemblies?
The article does not provide information on the potential cost implications of implementing this technology in the manufacturing process.
Are there any limitations to the integration of IEEE 1149.1 circuitry within interposers?
The article does not address any potential challenges or limitations that may arise from incorporating this circuitry into interposers.
Original Abstract Submitted
The disclosure describes a novel method and apparatus for improving interposers that connected stacked die assemblies to system substrates. The improvement includes the addition of IEEE 1149.1 circuitry within interposers to allow simplifying interconnect testing of digital and analog signal connections between the interposer and system substrate it is attached too. The improvement also includes the additional 1149.1 controlled circuitry that allows real time monitoring of voltage supply and ground buses in the interposer. The improvement also includes the additional of 1149.1 controlled circuitry that allows real time monitoring of functional digital and analog input and output signals in the interposer. The improvement also provides the ability to selectively serially link the 1149.1 circuitry in the interposer with 1149.1 circuitry in the die of the stack.
