18523620. DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING simplified abstract (Applied Materials, Inc.)
Contents
- 1 DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING
Organization Name
Inventor(s)
Uwe Hollerbach of Fremont CA (US)
Thomas L. Laidig of Richmond CA (US)
DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18523620 titled 'DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING
Simplified Explanation
The abstract of the patent application describes a method for attaching wiring connections to a component using design and field measured data to ensure accuracy.
- The innovation involves utilizing both design and field measured data of a component to create precise wiring connections.
- This method ensures that the wiring connections are accurately attached to the component.
- By combining design and field measured data, the process results in reliable and efficient wiring connections.
Potential Applications
The technology can be applied in various industries such as electronics, automotive, aerospace, and manufacturing where accurate wiring connections are crucial.
Problems Solved
This technology solves the problem of inaccuracies in wiring connections that can lead to malfunctions or failures in components.
Benefits
The benefits of this technology include improved accuracy, efficiency, and reliability in attaching wiring connections to components.
Potential Commercial Applications
The technology can be commercialized for use in industries that require precise wiring connections, such as electronics manufacturing and automotive assembly.
Possible Prior Art
One possible prior art could be the use of manual methods for attaching wiring connections to components, which may not always result in accurate connections.
Unanswered Questions
How does this technology compare to existing methods of attaching wiring connections to components?
This article does not provide a direct comparison to existing methods, leaving the reader to wonder about the advantages and disadvantages of this innovation in relation to current practices.
What are the specific industries or applications where this technology is most beneficial?
While the article mentions various industries where the technology can be applied, it does not delve into specific examples or case studies, leaving the reader curious about the practical implications in different sectors.
Original Abstract Submitted
Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.
