18522601. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

SEMICONDUCTOR PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chin-Hua Wang of New Taipei City (TW)

Po-Yao Lin of Zhudong Township (TW)

Feng-Cheng Hsu of New Taipei City (TW)

Shin-Puu Jeng of Po-Shan Village, Hsinchu (TW)

Wen-Yi Lin of New Taipei City (TW)

Shu-Shen Yeh of Taoyuan City (TW)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18522601 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The semiconductor package described in the abstract includes a first chip, a molding compound, thermal interface materials, a heat spreader, and identical width thermal interface materials.

• The first chip is placed on a package substrate.
• A molding compound surrounds the first chip.
• A first thermal interface material is placed over the first chip and the molding compound.
• A heat spreader is placed over the thermal interface material.
• A second thermal interface material is placed over the heat spreader.

Potential Applications

This technology could be applied in:

• High-performance computing systems
• Automotive electronics
• Industrial control systems

Problems Solved

• Improved thermal management in semiconductor packages
• Enhanced heat dissipation capabilities
• Increased reliability of electronic components

Benefits

• Better performance of electronic devices
• Extended lifespan of semiconductor components
• Enhanced overall system efficiency

Potential Commercial Applications

Optimized Thermal Interface Materials for Semiconductor Packages

Possible Prior Art

There may be existing patents or publications related to thermal interface materials in semiconductor packaging, but specific prior art is not provided in this article.

How does this technology compare to traditional thermal management solutions in terms of cost-effectiveness?

This article does not address the cost implications of implementing this technology compared to traditional thermal management solutions. Further research or analysis would be needed to determine the cost-effectiveness of this innovation.

What impact does the identical width of the thermal interface materials have on the overall thermal performance of the semiconductor package?

The article does not delve into the specific effects of having identical width thermal interface materials on the thermal performance of the semiconductor package. Additional testing or simulations may be required to understand the significance of this design choice.

Original Abstract Submitted

A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.