18522376. TEMPORARY SUBSTRATE ADHESIVE AND SUBSTRATE PROCESSING METHOD simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
- 1 TEMPORARY SUBSTRATE ADHESIVE AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TEMPORARY SUBSTRATE ADHESIVE AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TEMPORARY SUBSTRATE ADHESIVE AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Masaaki Hirakawa of Yokohama (JP)
Kazushi Tateyama of Yokohama (JP)
TEMPORARY SUBSTRATE ADHESIVE AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522376 titled 'TEMPORARY SUBSTRATE ADHESIVE AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The temporary substrate adhesive described in the patent application includes a silane coupling agent and a photobase generator, without the presence of a resin.
- Silane coupling agent and photobase generator are key components of the temporary substrate adhesive.
- The absence of resin sets this adhesive apart from traditional formulations.
Potential Applications
The technology could be used in industries such as electronics, automotive, and construction for temporary bonding needs.
Problems Solved
This adhesive provides a temporary bonding solution without the need for a resin, which can be advantageous in certain applications where resin may not be suitable.
Benefits
- Temporary bonding capability
- No resin required
- Versatile applications in various industries
Potential Commercial Applications
"Temporary Substrate Adhesive for Industrial Use"
Possible Prior Art
There may be prior art related to temporary adhesives without resin, but specific examples are not provided in this context.
Unanswered Questions
How does the absence of resin impact the overall performance of the adhesive?
The article does not delve into the specific effects of not having resin in the adhesive formulation.
Are there any potential drawbacks to using a temporary substrate adhesive without resin?
The potential downsides or limitations of this specific formulation are not discussed in the provided information.
Original Abstract Submitted
A temporary substrate adhesive according to an embodiment includes a silane coupling agent and a photobase generator, but does not include a resin.
