18522334. ACOUSTIC WAVE DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
- 1 ACOUSTIC WAVE DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ACOUSTIC WAVE DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ACOUSTIC WAVE DEVICE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Toshiki Tabei of Nagaokakyo-shi (JP)
Junpei Yasuda of Nagaokakyo-shi (JP)
ACOUSTIC WAVE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522334 titled 'ACOUSTIC WAVE DEVICE
Simplified Explanation
The abstract describes an acoustic wave device with two chips mounted on a substrate, each with ground bumps connected to a ground potential.
- The device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate.
- The first chip is bonded to the substrate with first bumps, including first ground bumps connected to a ground potential.
- The second chip is bonded to the substrate with second bumps, including second ground bumps connected to a ground potential.
- The number of first ground bumps is denoted as n1, the number of second ground bumps as n2, the height of the first ground bumps as h, and the height of the second ground bumps as hn.
Potential Applications
This technology could be used in:
- Wireless communication devices
- Acoustic sensors
- Signal processing systems
Problems Solved
- Improved signal quality
- Enhanced device performance
- Reduced interference
Benefits
- Higher efficiency
- Increased reliability
- Compact design
Potential Commercial Applications
Optimized for:
- Mobile phones
- IoT devices
- Wearable technology
Possible Prior Art
Prior art in the field of acoustic wave devices may include:
- Previous patents related to acoustic wave technology
- Research papers on acoustic wave sensors
Unanswered Questions
How does this technology compare to existing acoustic wave devices on the market?
This article does not provide a direct comparison with other acoustic wave devices in terms of performance, cost, or efficiency.
What specific industries or sectors could benefit the most from this technology?
The article does not specify which industries or sectors could see the greatest impact from the implementation of this acoustic wave device.
Original Abstract Submitted
An acoustic wave device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate, first bumps bonding the first acoustic wave chip to the substrate and including first ground bumps connected to a ground potential, second bumps bonding the second acoustic wave chip to the substrate and including second ground bumps connected to a ground potential. When a number of the first ground bumps is n1, a number of the second ground bumps is n2, a height of the first ground bumps is h and a height of the second ground bumps is h nn and hh
