18521711. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Jing-Cheng Lin of Hsinchu (TW)
Po-Hao Tsai of Taoyuan City (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521711 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Simplified Explanation
The semiconductor device described in the patent application features a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. The mark is formed from characters that are either cross-free characters or have an overlap count of less than two. In another embodiment, the mark is formed using a wobble scan methodology to reduce or eliminate defects from the marking process.
- Conductive via laterally separated from the semiconductor
- Mark formed from characters that are cross-free or have low overlap count
- Use of wobble scan methodology for mark formation
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for marking semiconductor devices with improved accuracy and reduced defects.
Problems Solved
- Reduced defects from the marking process - Improved accuracy in marking semiconductor devices
Benefits
- Enhanced quality control in semiconductor manufacturing - Increased reliability of marked semiconductor devices
Potential Commercial Applications
Optimizing Marking Process for Semiconductor Devices
Possible Prior Art
Prior art related to marking semiconductor devices with characters that are cross-free or have low overlap count may exist in the semiconductor industry. Research into existing methods and technologies for marking semiconductor devices could provide valuable insights into the novelty of this innovation.
Unanswered Questions
How does the wobble scan methodology compare to traditional marking methods in terms of efficiency and accuracy?
The article does not provide a direct comparison between the wobble scan methodology and traditional marking methods in semiconductor manufacturing.
What are the specific types of defects that can be reduced or eliminated by using the described marking process?
The article does not detail the specific defects that may be reduced or eliminated by implementing the marking process outlined in the patent application.
Original Abstract Submitted
A semiconductor device has a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. The mark is formed from characters that are either cross-free characters or else have a overlap count of less than two. In another embodiment the mark is formed using a wobble scan methodology. By forming marks as described, defects from the marking process may be reduced or eliminated.
