18521358. FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR
Organization Name
Inventor(s)
Myunghoon Kwak of Suwon-si Gyeonggi-do (KR)
Bohyeon Kim of Suwon-si Gyeonggi-do (KR)
Hyoungtak Cho of Suwon-si (KR)
Junghyeob Lee of Suwon-si (KR)
FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521358 titled 'FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR
Simplified Explanation
The patent application describes an electronic device with a hinge mechanism that allows it to switch between a folded state and an unfolded state. The device includes shape memory alloy materials in the first and second housings, as well as in the hinge device, which can be restored to their original shape when power is applied.
- First and second housings connected by a hinge mechanism
- First alloy member made of shape memory alloy material fixed to the housings and hinge device
- Second alloy device made of shape memory alloy material fixed to the housings at a different position
- Driving circuit to apply power to restore the shape of the alloy members
Potential Applications
The technology could be applied in foldable electronic devices such as smartphones, tablets, or laptops.
Problems Solved
The technology solves the problem of wear and tear on hinges in foldable devices, as the shape memory alloy materials can restore their original shape, increasing the longevity of the device.
Benefits
The use of shape memory alloy materials increases the durability and flexibility of foldable electronic devices, providing a seamless transition between folded and unfolded states.
Potential Commercial Applications
- "Shape Memory Alloy Technology for Foldable Devices: Enhancing Durability and Flexibility"
Possible Prior Art
There are existing patents related to shape memory alloy materials in electronic devices, particularly in the field of robotics and medical devices.
Unanswered Questions
How does the driving circuit determine when to apply power to restore the shape of the alloy members?
The patent application does not provide specific details on the triggering mechanism for the driving circuit.
What are the potential limitations or drawbacks of using shape memory alloy materials in electronic devices?
The patent application does not address any potential challenges or limitations associated with the use of shape memory alloy materials in electronic devices.
Original Abstract Submitted
An electronic device may include a first housing, a second housing, a hinge device configured to connect the first housing and the second housing so that the electronic device is switched from a folded state into an unfolded state, a first alloy member, at least a part of which is fixed to the first housing, the second housing, and the hinge device and which is made of a shape memory alloy material, a second alloy device, at least a part of which is fixed to the first housing and the second housing at a position different from the first alloy member and which is made of a shape memory alloy material, and a driving circuit configured to apply power to at least one of the first alloy member and the second alloy member so that at least one of the first alloy member and the second alloy member is restored. Various other embodiments may be possible.
- Samsung Electronics Co., Ltd.
- Baekeun Cho of Suwon-si (KR)
- Myunghoon Kwak of Suwon-si Gyeonggi-do (KR)
- Bohyeon Kim of Suwon-si Gyeonggi-do (KR)
- Moonsun Kim of Suwon-si (KR)
- Jookwan Lee of Suwon-si (KR)
- Hyoungtak Cho of Suwon-si (KR)
- Soyoung Lee of Suwon-si (KR)
- Yangwook Kim of Suwon-si (KR)
- Junghyeob Lee of Suwon-si (KR)
- H04M1/02