18520872. DEVICE LAYER INTERCONNECTS simplified abstract (Intel Corporation)
Contents
- 1 DEVICE LAYER INTERCONNECTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEVICE LAYER INTERCONNECTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
DEVICE LAYER INTERCONNECTS
Organization Name
Inventor(s)
Mauro J. Kobrinsky of Portland OR (US)
Marni Nabors of Portland OR (US)
DEVICE LAYER INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520872 titled 'DEVICE LAYER INTERCONNECTS
Simplified Explanation
The abstract describes integrated circuit structures, devices, and methods related to device layer interconnects within an IC die. Here are some key points to explain the innovation:
- IC die includes a device layer with a transistor array on a semiconductor fin.
- Device layer interconnect within the transistor array is in electrical contact with multiple source/drain regions.
- The interconnect allows for efficient communication between different regions of the transistor array.
Potential Applications
The technology described in the patent application could be applied in various fields such as:
- Semiconductor manufacturing
- Electronics industry
- Integrated circuit design
Problems Solved
This technology addresses several issues in the field of integrated circuits, including:
- Improving connectivity within transistor arrays
- Enhancing overall performance of IC devices
- Streamlining manufacturing processes
Benefits
Some of the benefits of this technology include:
- Increased efficiency in data transfer within IC devices
- Enhanced functionality of semiconductor components
- Potential for higher performance in electronic devices
Potential Commercial Applications
The innovation could have commercial applications in industries such as:
- Consumer electronics
- Telecommunications
- Automotive technology
Possible Prior Art
One possible prior art in this field is the use of traditional interconnect technologies in semiconductor devices. However, the specific integration of device layer interconnects within a transistor array may be a novel approach.
Unanswered Questions
How does this technology compare to existing interconnect solutions in terms of performance and efficiency?
The article does not provide a direct comparison with other interconnect technologies currently in use in the industry.
Are there any limitations or challenges associated with implementing this technology on a larger scale?
The potential obstacles or scalability issues related to the widespread adoption of this technology are not addressed in the article.
Original Abstract Submitted
Described herein are integrated circuit (IC) structures, devices, and methods associated with device layer interconnects. For example, an IC die may include a device layer including a transistor array along a semiconductor fin, and a device layer interconnect in the transistor array, wherein the device layer interconnect is in electrical contact with multiple different source/drain regions of the transistor array.
