18519519. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (TOKYO ELECTRON LIMITED)
Contents
- 1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Fumihiro Kamimura of Kumamoto (JP)
Masatoshi Kasahara of Kumamoto (JP)
Teruomi Minami of Kumamoto (JP)
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18519519 titled 'SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Simplified Explanation
The patent application describes a method for processing a substrate by heating it, forming a liquid film on one surface, processing the surface with a chemical liquid, and then cooling the substrate.
- Heating the substrate to increase its temperature.
- Forming a liquid film of pre-wetting liquid on one surface of the substrate by supplying the liquid while heating and rotating the substrate at a certain speed.
- Processing the surface with a chemical liquid by supplying it while heating and rotating the substrate at a lower speed.
- Cooling the substrate after processing.
Potential Applications
This technology could be applied in the semiconductor industry for cleaning and etching processes.
Problems Solved
This method provides a more efficient and controlled way of processing substrates compared to traditional methods.
Benefits
- Improved substrate processing efficiency - Enhanced control over the processing steps - Potential for higher quality end products
Potential Commercial Applications
"Advanced Substrate Processing Method for Semiconductor Industry"
Possible Prior Art
There may be prior art related to substrate processing methods using liquid films and chemical liquids, but specific examples are not provided in the abstract.
Unanswered Questions
How does this method compare to existing substrate processing techniques in terms of cost and time efficiency?
The article does not provide a direct comparison with existing methods in terms of cost and time efficiency.
What are the specific chemical liquids and pre-wetting liquids used in this method, and are they readily available in the market?
The article does not mention the specific types of chemical and pre-wetting liquids used in the process, nor does it address their availability in the market.
Original Abstract Submitted
A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.
