18519460. INTEGRATED CIRCUIT DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
INTEGRATED CIRCUIT DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18519460 titled 'INTEGRATED CIRCUIT DEVICE
Simplified Explanation
The abstract of the patent application describes an integrated circuit (IC) device with a circuit containing transistors, an input, and an output connector that electrically connects to the output through different metal layers.
- The IC device includes a circuit with transistors connected between the input and output.
- The output is located in a first metal layer within the circuit.
- The output connector consists of a first conductive pattern in the first metal layer and a second conductive pattern in a different second metal layer.
- The second conductive pattern links the output to the first conductive pattern.
Potential Applications
- Integrated circuits in electronic devices
- Circuit design and manufacturing
- Semiconductor technology
Problems Solved
- Efficient electrical coupling between circuit components
- Improved signal transmission within the IC device
- Enhanced performance and reliability of the circuit
Benefits
- Higher integration density in IC devices
- Enhanced electrical connectivity and signal transmission
- Improved overall functionality and performance of electronic devices
Original Abstract Submitted
An integrated circuit (IC) device includes at least one circuit having an input and an output, and an output connector electrically coupled to the output. The circuit further includes a plurality of transistors electrically coupled with each other between the input and the output. The output is in a first metal layer. The output connector includes a first conductive pattern in the first metal layer, and a second conductive pattern in a second metal layer different from the first metal layer. The second conductive pattern electrically couples the output to the first conductive pattern.
