18517263. SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE simplified abstract (SONY GROUP CORPORATION)
Contents
- 1 SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE
Organization Name
Inventor(s)
Hideaki Togashi of Kanagawa (JP)
SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18517263 titled 'SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE
Simplified Explanation
The abstract describes a solid-state imaging device with photoelectric conversion elements, a through electrode, an amplifier transistor, and a floating diffusion on a semiconductor substrate.
- Photoelectric conversion elements are on one side of the semiconductor substrate.
- Through electrode connects the photoelectric conversion elements to the second surface of the substrate.
- Amplifier transistor and floating diffusion are on the second surface of the substrate.
- Photoelectric conversion elements are connected to the gate of the amplifier transistor and the floating diffusion via the through electrode.
Potential Applications
This technology can be applied in:
- Digital cameras
- Medical imaging devices
- Surveillance cameras
Problems Solved
This technology helps in:
- Improving image quality
- Enhancing sensitivity to light
- Reducing noise in imaging devices
Benefits
The benefits of this technology include:
- Higher resolution images
- Improved low-light performance
- Enhanced overall image quality
Potential Commercial Applications
This technology can be commercially applied in:
- Smartphone cameras
- Security cameras
- Automotive cameras
Possible Prior Art
One possible prior art for this technology could be the use of through electrodes in solid-state imaging devices to improve signal processing and image quality.
Unanswered Questions
How does this technology compare to traditional imaging devices?
This article does not provide a direct comparison between this technology and traditional imaging devices.
What are the potential limitations of this technology?
The article does not address any potential limitations or drawbacks of this technology.
Original Abstract Submitted
There is provided a solid-state imaging device including: one or more photoelectric conversion elements provided on side of a first surface of a semiconductor substrate; a through electrode coupled to the one or more photoelectric conversion elements, and provided between the first surface and a second surface of the semiconductor substrate; and an amplifier transistor and a floating diffusion provided on the second surface of the semiconductor substrate, in which the one or more photoelectric conversion elements are coupled to a gate of the amplifier transistor and the floating diffusion via the through electrode.
