18516969. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Sung-Hui Huang of Yilan County (TW)
Chien-Yuan Huang of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516969 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor device described in the patent application includes a first substrate, an electronic component, and a lid. The first substrate has a top side, a bottom side, a lateral side, and a connector structure. The electronic component is connected to the top side of the first substrate and the connector structure. The lid consists of a wall part with a ring part attached to the top side of the first substrate, an overhang part with a first part connected to the lateral side of the first substrate, and a second part extending from the first part away from the lateral side of the first substrate.
- The semiconductor device comprises a first substrate, an electronic component, and a lid.
- The first substrate has a top side, a bottom side, a lateral side, and a connector structure.
- The electronic component is coupled to the top side of the first substrate and the connector structure.
- The lid includes a wall part with a ring part attached to the top side of the first substrate, an overhang part with a first part connected to the lateral side of the first substrate, and a second part extending from the first part away from the lateral side of the first substrate.
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other portable electronic devices.
Problems Solved
This technology helps in protecting the electronic components within the semiconductor device from external elements such as dust, moisture, and physical damage.
Benefits
The semiconductor device with this technology offers improved durability and reliability, ensuring the longevity of the electronic components.
Potential Commercial Applications
The technology could be applied in the manufacturing of consumer electronics, industrial equipment, automotive systems, and medical devices.
Possible Prior Art
One possible prior art could be the use of similar lid structures in semiconductor devices to protect electronic components.
Unanswered Questions
How does this technology impact the overall size of the semiconductor device?
The abstract does not provide information on how the addition of the lid and connector structure affects the size of the semiconductor device. This could be crucial for applications where size constraints are a concern.
What materials are used in the construction of the lid and connector structure?
The abstract does not mention the specific materials used in the construction of the lid and connector structure. Understanding the materials could provide insights into the durability and performance of the semiconductor device.
Original Abstract Submitted
A semiconductor device includes a first substrate, an electronic component, and a lid. The first substrate includes a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a connector structure. The electronic component is coupled to the first substrate top side and coupled to the connector structure. The lid includes a wall part including a ring part coupled to the first substrate top side, a first part of an overhang part coupled to the first substrate lateral side, and a second part of the overhang part extending from the first part of the overhang part away from the first substrate lateral side.
