View source for 18516703. SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Tsai-Hao Hung of Hsinchu (TW)|Tsai-Hao Hung of Hsinchu (TW)]][[Category:Tsai-Hao Hung of Hsinchu (TW)]]

[[:Category:Ping-Cheng Ko of Hsinchu (TW)|Ping-Cheng Ko of Hsinchu (TW)]][[Category:Ping-Cheng Ko of Hsinchu (TW)]]

[[:Category:Tzu-Yang Lin of Hsinchu (TW)|Tzu-Yang Lin of Hsinchu (TW)]][[Category:Tzu-Yang Lin of Hsinchu (TW)]]

[[:Category:Fang-Yu Liu of Hsinchu (TW)|Fang-Yu Liu of Hsinchu (TW)]][[Category:Fang-Yu Liu of Hsinchu (TW)]]

[[:Category:Cheng-Han Wu of Hsinchu (TW)|Cheng-Han Wu of Hsinchu (TW)]][[Category:Cheng-Han Wu of Hsinchu (TW)]]

==SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18516703 titled 'SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER

==Simplified Explanation==

The patent application describes semiconductor processing apparatuses utilizing an electrostatic discharge (ESD) prevention layer to reduce ESD events between a semiconductor wafer and components of the apparatuses.

* The semiconductor processing apparatus includes a wafer handling structure supporting the semiconductor wafer during processing.
* An ESD prevention layer on the wafer handling structure consists of a first material and a second material with higher electrical conductivity.
* The second material's electrical conductivity is greater than that of the first material.

== Potential Applications ==
* Semiconductor manufacturing
* Electronics industry
* Research and development in semiconductor technology

== Problems Solved ==
* Prevention of electrostatic discharge events during semiconductor processing
* Protection of semiconductor wafers from damage
* Enhanced reliability of semiconductor processing equipment

== Benefits ==
* Improved yield in semiconductor manufacturing
* Increased equipment lifespan
* Enhanced safety for semiconductor processing personnel


==Original Abstract Submitted==

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.



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