18515616. INTERFACE TOOL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
INTERFACE TOOL
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Jyh-Shiou Hsu of Hsin-Chu (TW)
Chyi-Tsong Ni of Hsinchu City (TW)
Mu-Tsang Lin of Changhua County (TW)
Su-Horng Lin of Hsinchu City (TW)
INTERFACE TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18515616 titled 'INTERFACE TOOL
Simplified Explanation
The patent application describes a closed gas circulation system for maintaining a conditioned environment in a chamber of an interface tool to reduce oxidation of semiconductor wafers.
- Sealed plenum, circulation fans, and a fan filter unit (FFU) inlet are used to contain, filter, condition, and re-circulate gas through the chamber.
- Precise control over relative humidity and oxygen concentration of the gas is achieved, reducing oxidation of semiconductor wafers.
- Air-flow rectifier, return vent, and vacuum pumps create a downflow of collimated gas in the chamber, automatically controlling pressure and flow of gas.
Potential Applications
The technology can be applied in semiconductor manufacturing processes where precise control over gas environment is crucial to prevent oxidation of wafers.
Problems Solved
The closed gas circulation system solves the problem of oxidation of semiconductor wafers by maintaining a conditioned gas environment in the chamber, eliminating the need to introduce external air.
Benefits
- Reduced oxidation of semiconductor wafers - Precise control over gas environment - Automatic pressure and flow control for consistent performance
Original Abstract Submitted
A closed gas circulation system may include a sealed plenum, circulation fans, and a fan filter unit (FFU) inlet to contain, filter, condition, and re-circulate a gas through a chamber of an interface tool. The gas provided to the chamber is maintained in a conditioned environment in the closed gas circulation system as opposed to introducing external air into the chamber through the FFU inlet. This enables precise control over the relative humidity and oxygen concentration of the gas used in the chamber, which reduces the oxidation of semiconductor wafers that are transferred through the chamber. The closed gas circulation system may also include an air-flow rectifier, a return vent, and one or more vacuum pumps to form a downflow of collimated gas in the chamber and to automatically control the feed-forward pressure and flow of gas through the chamber and the sealed plenum.
