18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wei-Hung Lin of Hsinchu County (TW)
Hui-Min Huang of Taoyuan City (TW)
Chang-Jung Hsueh of Taipei (TW)
Ming-Da Cheng of Taoyuan City (TW)
Mirng-Ji Lii of Hsinchu County (TW)
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18515274 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Simplified Explanation
The method involves cutting a package into smaller packages and forming a polygonal structure with at least 5 nodes.
- First package is provided with multiple first and second dies.
- First sawing process cuts the first package into smaller packages.
- One of the smaller packages contains three first dies and one second die.
- Second sawing process removes the second die from the package.
- Resulting cut package forms a polygonal structure with 5 or more nodes.
Potential Applications
This technology could be used in semiconductor packaging, electronic devices, and microelectronics.
Problems Solved
1. Efficient packaging of dies. 2. Creating polygonal structures for specific applications. 3. Improving packaging density.
Benefits
1. Increased packaging efficiency. 2. Versatile polygonal structures. 3. Enhanced overall device performance.
Original Abstract Submitted
Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.
