18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
Contents
- 1 MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
Dong Yeong Kim of Suwon-si (KR)
Woo Chul Shin of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH - A simplified explanation of the abstract
This abstract first appeared for US patent application 18515090 titled 'MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH
Simplified Explanation
The multilayer electronic component described in the patent application includes a silicon organic compound layer that improves bending strength and humidity resistance reliability.
- Silicon organic compound layer improves bending strength and humidity resistance reliability
- Body cover portion is disposed in a region without electrode layers
- Extending portion extends from body cover portion between electrode layer and conductive resin layer
Potential Applications
The technology could be applied in various electronic devices where bending strength and humidity resistance are crucial, such as smartphones, tablets, wearables, and automotive electronics.
Problems Solved
This technology addresses the issues of bending strength and humidity resistance in electronic components, which are essential for durability and reliability in various applications.
Benefits
The benefits of this technology include improved reliability, durability, and performance of electronic components in challenging environments, leading to enhanced overall product quality.
Potential Commercial Applications
The technology could be commercially benefit electronic manufacturers looking to improve the quality and reliability of their products, especially in industries where environmental conditions are a concern.
Possible Prior Art
One possible prior art could be the use of various materials and layering techniques to enhance the durability and reliability of electronic components in different applications.
Unanswered Questions
How does the silicon organic compound layer specifically improve bending strength and humidity resistance reliability in electronic components?
The abstract mentions that the silicon organic compound layer improves bending strength and humidity resistance reliability, but it does not provide specific details on the mechanisms or properties of the layer that lead to these improvements.
What are the specific electronic devices or industries that could benefit the most from this technology?
While the potential applications section mentions some examples like smartphones and automotive electronics, it does not delve into specific details on the ideal use cases or industries where this technology could have the most significant impact.
Original Abstract Submitted
A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.
