18510628. MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ting-Li Yang of Tainan City (TW)
Wen-Hsiung Lu of Tainan City (TW)
Cheng Jen Lin of Kaohsiung City (TW)
Chin Wei Kang of Tainan City (TW)
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18510628 titled 'MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The abstract describes a patent application for a micro electro mechanical system (MEMS) that includes a circuit substrate with electronic circuitry, a support substrate with a recess, a bonding layer between the circuit substrate and support substrate, through holes from the circuit substrate to the recess, a first conductive layer on the front side of the circuit substrate, and a second conductive layer on the inner wall of the recess. The first and second conductive layers are connected through the through holes.
- Circuit substrate with electronic circuitry
- Support substrate with a recess
- Bonding layer between circuit and support substrates
- Through holes connecting circuit substrate to the recess
- First conductive layer on the front side of the circuit substrate
- Second conductive layer on the inner wall of the recess
Potential Applications
- MEMS sensors
- Micro actuators
- Biomedical devices
Problems Solved
- Improved electrical connectivity in MEMS devices
- Enhanced performance of MEMS sensors and actuators
Benefits
- Increased reliability
- Higher efficiency
- Miniaturization of devices
Original Abstract Submitted
A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.
