18509801. Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract (Apple Inc.)
Contents
- 1 Seal Ring Designs Supporting Efficient Die to Die Routing
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Seal Ring Designs Supporting Efficient Die to Die Routing - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Seal Ring Designs Supporting Efficient Die to Die Routing
Organization Name
Inventor(s)
Sanjay Dabral of Cupertino CA (US)
Chi Nung Ni of Foster City CA (US)
Long Huang of San Jose CA (US)
SivaChandra Jangam of Milpitas CA (US)
Seal Ring Designs Supporting Efficient Die to Die Routing - A simplified explanation of the abstract
This abstract first appeared for US patent application 18509801 titled 'Seal Ring Designs Supporting Efficient Die to Die Routing
Simplified Explanation
The patent application describes chip sealing designs for die-to-die communication, including a split metallic seal structure and a through seal interconnect.
- Split metallic seal structure:
- Includes a lower metallic seal and an upper metallic seal with overlapping metallization layers. - Allows for die-to-die communication within the chip structure.
- Through seal interconnect:
- Navigates through the split metallic seal structure. - Facilitates communication between different dies within the chip.
Potential Applications
This technology could be applied in: - Semiconductor industry for improved die-to-die communication. - Electronic devices requiring efficient chip sealing designs.
Problems Solved
- Enhances communication between different dies within a chip. - Provides a reliable and efficient chip sealing solution for die-to-die communication.
Benefits
- Improved performance and reliability of electronic devices. - Enhanced connectivity within semiconductor chips. - Cost-effective chip sealing designs for die-to-die communication.
Potential Commercial Applications
Optimizing Die-to-Die Communication with Split Metallic Seal Structure and Through Seal Interconnect
Possible Prior Art
There may be prior art related to chip sealing designs for die-to-die communication, but specific examples are not provided in this article.
Unanswered Questions
How does this technology compare to existing chip sealing designs for die-to-die communication?
This article does not provide a direct comparison with existing chip sealing designs for die-to-die communication. Further research or analysis would be needed to determine the specific advantages of this technology over others.
What are the manufacturing considerations for implementing this chip sealing design in semiconductor production processes?
The article does not address the manufacturing considerations for implementing this chip sealing design. Understanding the practical aspects of production, such as cost, complexity, and compatibility with existing processes, would be important for assessing the feasibility of adopting this technology.
Original Abstract Submitted
Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.
