18509053. INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Xin-Hua Huang of Xihu Township (TW)

Ping-Yin Liu of Yonghe City (TW)

Hung-Hua Lin of Taipei City (TW)

Hsun-Chung Kuang of Hsinchu (TW)

Yuan-Chih Hsieh of Hsinchu (TW)

Lan-Lin Chao of Sindian City (TW)

Chia-Shiung Tsai of Hsinchu (TW)

Xiaomeng Chen of Baoshan Township (TW)

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18509053 titled 'INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

Simplified Explanation

The method described in the patent application involves activating a surface of a first package component through plasma treatment, removing oxide regions from metal pads on the first package component, and then performing a pre-bonding process to bond the first package component to a second package component.

• Plasma activation performed on surface of first package component
• Removal of oxide regions from metal pads on first package component
• Pre-bonding process used to bond first package component to second package component

Potential Applications

This technology could be applied in the semiconductor industry for packaging components in electronic devices.

Problems Solved

This method helps to improve the bonding process between package components by removing oxide regions and enhancing surface activation.

Benefits

- Enhanced bonding strength between package components - Improved reliability of electronic devices - Increased efficiency in the packaging process

Original Abstract Submitted

A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.