18508807. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sunkyoung Seo of Cheonan-si (KR)
Teak Hoon Lee of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18508807 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application consists of a sequential stack of first and second semiconductor chips, connected by a first internal connection member. The first semiconductor chip has a substrate with a conductive pad on the top surface, while the second semiconductor chip has a substrate with a conductive bump on the bottom surface. The first internal connection member links the conductive pad of the first chip to the conductive bump of the second chip, with the first width of the pad being smaller than the second width of the bump.
- The semiconductor package includes a sequential stack of first and second semiconductor chips.
- A first internal connection member connects the first and second semiconductor chips.
- The first semiconductor chip has a substrate with a conductive pad on the top surface.
- The second semiconductor chip has a substrate with a conductive bump on the bottom surface.
- The first internal connection member connects the conductive pad of the first chip to the conductive bump of the second chip.
- The first width of the pad is smaller than the second width of the bump.
Potential Applications
- Semiconductor industry
- Electronics manufacturing
- Integrated circuits
Problems Solved
- Efficient internal connection between semiconductor chips
- Improved performance and reliability of semiconductor packages
Benefits
- Enhanced connectivity
- Compact design
- Increased functionality and performance
Original Abstract Submitted
A semiconductor package includes a sequential stack of first and second semiconductor chips, and a first internal connection member that connects the first and second semiconductor chips to each other. The first semiconductor chip includes a first substrate that has a first top surface and a first bottom surface that are opposite to each other, and a first conductive pad on the first top surface. The second semiconductor chip includes a second substrate that has a second top surface and a second bottom surface that are opposite to each other, and a second conductive bump on the second bottom surface. The first internal connection member connects the first conductive pad to the second conductive bump. The first conductive pad has a first width in one direction. The second conductive bump has a second width in the one direction. The first width is smaller than the second width.
