18495076. IMAGING APPARATUS AND IMAGING METHOD, CAMERA MODULE, AND ELECTRONIC APPARATUS CAPABLE OF DETECTING A FAILURE IN A STRUCTURE IN WHICH SUBSTRATES ARE STACKED simplified abstract (Sony Semiconductor Solutions Corporation)

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IMAGING APPARATUS AND IMAGING METHOD, CAMERA MODULE, AND ELECTRONIC APPARATUS CAPABLE OF DETECTING A FAILURE IN A STRUCTURE IN WHICH SUBSTRATES ARE STACKED

Organization Name

Sony Semiconductor Solutions Corporation

Inventor(s)

Takumi Oka of Kanagawa (JP)

Atsushi Suzuki of Kanagawa (JP)

Naoki Kawazu of Kanagawa (JP)

IMAGING APPARATUS AND IMAGING METHOD, CAMERA MODULE, AND ELECTRONIC APPARATUS CAPABLE OF DETECTING A FAILURE IN A STRUCTURE IN WHICH SUBSTRATES ARE STACKED - A simplified explanation of the abstract

This abstract first appeared for US patent application 18495076 titled 'IMAGING APPARATUS AND IMAGING METHOD, CAMERA MODULE, AND ELECTRONIC APPARATUS CAPABLE OF DETECTING A FAILURE IN A STRUCTURE IN WHICH SUBSTRATES ARE STACKED

Simplified Explanation

The present disclosure pertains to an imaging apparatus and method, a camera module, and an electronic apparatus capable of detecting a failure in an imaging device with a stacked substrate structure.

  • The innovation involves an imaging device with multiple substrates stacked on top of each other.
  • The technology enables the detection of failures within the imaging device.
  • The camera module and electronic apparatus are designed to incorporate this failure detection capability.

Potential Applications

This technology can be applied in:

  • Surveillance systems
  • Medical imaging devices
  • Automotive cameras
  • Smartphone cameras

Problems Solved

  • Ensures early detection of failures in imaging devices
  • Improves overall reliability of the imaging apparatus
  • Reduces downtime and maintenance costs associated with device failures

Benefits

  • Enhanced reliability and performance of imaging devices
  • Early detection of failures leads to timely maintenance
  • Increased lifespan of the imaging apparatus


Original Abstract Submitted

The present disclosure relates to an imaging apparatus and an imaging method, a camera module, and an electronic apparatus that are capable of detecting a failure in an imaging device having a structure in which a plurality of substrates are stacked.